Itani, H.; Santa, M.; Keil, P.; Grundmeier, G.: Backside SERS Studies of Inhibitor Transport Through Polyelectrolyte Films on Ag-substrates. Journal of Colloid and Interface Science 357 (2), pp. 480 - 486 (2011)
Posner, R.; Santa, M.; Grundmeier, G.: Wet- and Corrosive De-Adhesion Processes of Water-Borne Epoxy Film Coated Steel I. Interface Potentials and Characteristics of Ion Transport Processes. Journal of the Electrochemical Society 158 (3), pp. C29 - C35 (2011)
Santa, M.; Posner, R.; Grundmeier, G.: Wet- and Corrosive De-Adhesion Processes of Water-Borne Epoxy Film Coated Steel II. The Influence of -Glycidoxypropyltrimethoxysilane as an Adhesion Promoting Additive. Journal of the Electrochemical Society 158 (3), pp. C36 - C41 (2011)
Santa, M.; Posner, R.; Grundmeier, G.: In-situ study of the deterioration of thiazole/gold and thiazole/silver interfaces during interfacial ion transport processes. Journal of Electroanalytical Chemistry 643 (1-2), pp. 94 - 101 (2010)
Kundu, S.; Nagaiah, T.C.; Xia, W.; Wang, Y. M.; Van Dommele, S.; Bitter, J. H.; Santa, M.; Grundmeier, G.; Bron, M.; Schuhmann, W.et al.; Muhler, M.: Electrocatalytic Activity and Stability of Nitrogen-Containing Carbon Nanotubes in the Oxygen reduction Reaction. J. Phys. Chem. C 113 (32), pp. 14302 - 14310 (2009)
Santa, M.; Posner, R.; Grundmeier, G.: In-situ backside surface enhanced Raman study on the reactive wetting process at noble metal-monolayer interfaces supported by SKP, XPS and ToF-SIMS. Kurt Schwabe Symposium 2009, Erlangen, Germany (2009)
Santa, M.; Posner, R.; Grundmeier, G.: Surface enhanced Raman spectroscopy and Scanning Kelvin Probe studies of corrosive de-adhesion at polymer-metal interfaces. The 59th Annual Meeting of the International Society of Electrochemistry, Seville, Spain (2008)
Santa, M.: Combined in-situ spectroscopic and electrochemical studies of interfacial and interphasial reactions during adsorption and de-adhesion of polymer films on metals. Dissertation, Universität Paderborn, Paderborn, Germany (2010)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…