Dehm, G.: Mechanische Eigenschaften in kleinen Dimensionen. Lecture: Vorlesung (3LP), SS 2015, Ruhr-Universität Bochum, Bochum, Germany, May 18, 2015 - May 22, 2015
Dehm, G.: Mechanische Eigenschaften in kleinen Dimensionen. Lecture: Vorlesung: Mechanische Eigenschaften in kleinen Dimensionen (2SWS), Ruhr-Universität Bochum, Germany, May 06, 2014 - May 14, 2014
Dehm, G.: Mechanische Eigenschaften in kleinen Dimensionen. Lecture: Vorlesung, SS 2013, Ruhr-Universität Bochum, Bochum, Germany, May 06, 2013 - June 24, 2013
Brognara, A.: Design of ZrCu thin film metallic glasses with tailored mechanical properties through control of composition and nanostructure. Dissertation, RUB Bochum, Bochum, Germany (2025)
Hosseinabadi, R.: Dislocation transmission through coherent and incoherent twin boundaries in copper at the micron scale. Dissertation, Ruhr University Bochum (2024)
Patil, P.: Influence of plastic anisotropy on the deformation behaviour of Austenitic stainless-steel during single micro-asperity wear. Dissertation, Ruhr-Uiversität-Bochum (2023)
Rao, J.: Hydrogen effects on the mechanical behaviour of FeCr alloys investigated by in-situ nanoindentation. Dissertation, Ruhr-Universität Bochum (2023)
Jentner, R.: Phase identification and micromechanical characterization of an advanced high-strength low-alloy steel. Dissertation, Ruhr-Universität Bochum (2023)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
Here the focus lies on investigating the temperature dependent fracture of materials down to the individual microstructural length-scales, such as respective phases, grain/phase boundaries or hetero-interfaces, to understand brittle-ductile transitions in deformation and the role of chemistry or crystallography on it.