Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.: Film thickness effects on the deformation behavior of Cu/Cr thin films on polyimide. TMS 2014: 143rd Annual Meeting & Exhibition, San Diego, CA, USA (2014)
Cordill, M. J.; Glushko, O.; Kreith, J.; Marx, V. M.; Kirchlechner, C.; Zizak, I.; Struntz, T.; Fantner, E.: In-situ squared: multi property thin film measurements during straining. Nano- and Micromechanical Testing in Materials Research and Development IV, Olhão, Portugal (2013)
Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.: Deformation behavior of a Cr interlayer buried under Cu films on polyimide. GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPIE, Düsseldorf, Germany (2013)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Deformation behavior of thin Cu/Cr films on polyimide. Small Scale Plasticity School, Cargèse, Corsica, France (2013)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion behavior of Cu–Cr thin films on polyimide substrate. ECI Conference "Nano- and Micro-Mechanical Testing in Materials Research and Development IV", Olhão, Portugal (2013)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion Behavior of Cu–Cr Thin Films on Polyimide Substrate. TMS 2013: 142nd Annual Meeting & Exhibition, San Antonio, TX, USA (2013)
Cordill, M. J.; Marx, V. M.: In-situ Tensile Straining of Metal Films on Polymer Substrates under an AFM. 2012 MRS Fall Meeting & Exhibit, Hynes Convention Center, Boston, MA, USA (2012)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Dehm, G.; Cordill, M. J.: In-situ fracture study of thin Cu films on polyimide substrate. GDRi MECANO General Meeting 2012, Ecole de Mines, Paris, France (2012)
Marx, V. M.: The mechanical behavior of thin metallic films on flexible polymer substrate. Dissertation, Ruhr-Universität Bochum, Bochum, Germany (2016)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…