Li, J.; Pharr, G. M.; Kirchlechner, C.: Quantitative insights into the dislocation source behavior of twin boundaries suggest a new dislocation source mechanism. Journal of Materials Research 36 (10), pp. 2037 - 2046 (2021)
Luo, W.; Kirchlechner, C.; Li, J.; Dehm, G.; Stein, F.: Composition dependence of hardness and elastic modulus of the cubic and hexagonal NbCo2 Laves phase polytypes studied by nanoindentation. Journal of Materials Research 35 (2), pp. 185 - 195 (2020)
Qin, Y.; Li, J.; Herbig, M.: Microstructural origin of the outstanding durability of the high nitrogen bearing steel X30CrMoN15-1. Materials Characterization 159, 110049 (2020)
Li, J.; Dehm, G.; Kirchlechner, C.: Dislocation source activation by nanoindentation in single crystals and at grain boundaries. E-MRS Spring, Strasbourg, France (2018)
Li, J.; Dehm, G.; Kirchlechner, C.: Differences in dislocation source activation stress in the grain interior and at twin boundaries using nanoindentation. Nanobruecken 2018, Erlangen, Germany (2018)
Li, J.; Dehm, G.; Kirchlechner, C.: Grain Boundaries acting as dislocation sources. Gordon Research Seminar "Thin Film & Small Scale Mechanical Behavior", Lewiston, ME, USA (2018)
Li, J.: Probing dislocation nucleation in grains and at Ʃ3 twin boundaries of Cu alloys by nanoindentation. Dissertation, Ruhr-Universität Bochum (2020)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.