Kim, Y.-J.; Kim, H.; Kang, M.; Rhee, K.; Shin, S. Y.; Lee, S.: Correlation of microstructure, chip-forming properties, and dynamic torsional properties in free-machining steels. Metallurgical and Materials Transactions A 44 (10), pp. 4613 - 4625 (2013)
Shin, S. Y.: Effects of microstructure on tensile, charpy impact, and crack tip opening displacement properties of two API X80 pipeline steels. Metallurgical and Materials Transactions A 44 (6), pp. 2613 - 2624 (2013)
Sohn, S. S.; Han, S. Y.; Shin, S. Y.; Bae, J.; Lee, S.: Effects of microstructure and pre-strain on Bauschinger effect in API X70 and X80 linepipe steels. Metals and Materials International 19 (3), pp. 423 - 431 (2013)
Sohn, S. S.; Han, S. Y.; Shin, S. Y.; Bae, J.; Lee, S.: Analysis and estimation of the yield strength of API X70 and X80 linepipe steels by double-cycle simulation tests. Metals and Materials International 19 (3), pp. 377 - 388 (2013)
Kim, H.; Kang, M.; Shin, S. Y.; Lee, S.: Alligatoring phenomenon occurring during hot rolling of free-machining steel wire rods. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 568, pp. 8 - 19 (2013)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…