Lee, S.; Duarte, M. J.; Liebscher, C.; Oh, S. H.; Dehm, G.: Dislocation Plasticity in Single Crystal FeCrCoMnNi HEA by in-situ TEM Deformation. Schöntal Symposium - Dislocation based plasticity, Schöntal, Germany (2018)
Peter, N. J.; Kirchlechner, C.; Liebscher, C.; Dehm, G.: Effect of the atomistic grain boundary structure on dislocation interaction in copper. Gordon Research Conference (GRC) 2016, Thin Film & Small Scale Mechanical Behavior
, Lewiston, ME, USA (2016)
Meiners, T.; Liebscher, C.; Dehm, G.: Atomic structure and segregation phenomena at copper grain boundaries. EMC2016, The 16th European Microscopy Congress, Lyon, France (2016)
Peter, N. J.; Kirchlechner, C.; Liebscher, C.; Dehm, G.: Beam induced atomic migration at Ag containing nanofacets at an asymmetric Cu grain boundary. European Microscopy Congress (EMC) 2016
, Lyon, France (2016)
Liebscher, C.; Radmilovic, V. R.; Dahmen, U.; Asta, M. D.; Ghosh, G.: Hierarchical Microstructure of Ferritic Superalloys. IAMNano 2015 - The International Workshop on Advance
and In-situ Microscopies of Functional Nanomaterials and
Devices, Hamburg, Germany (2015)
Dehm, G.; Liebscher, C.; Völker, B.; Scheu, C.: Organizer of the “IAMNano 2019 Düsseldorf” - International Workshop on Advanced In Situ Microscopies of Functional Nanomaterials and Devices. (2019)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.