Li, Y.; Herbig, M.; Goto, S.; Raabe, D.: Atomic scale characterization of white etching area and its adjacent matrix in a martensitic 100Cr6 bearing steel. Materials Characterization 123, pp. 349 - 353 (2017)
Lübke, A.; Loza, K.; Patnaik, R.; Enax, J.; Raabe, D.; Prymak, O.; Fabritius, H.-O.; Gaengler, P.; Epple, M.: Reply to the ‘Comments on “Dental lessons from past to present: ultrastructure and composition of teeth from plesiosaurs, dinosaurs, extinct and recent sharks”’ by H. Botella et al., RSC Adv., 2016, 6, 74384–74388. RSC Advances 7 (11), pp. 6215 - 6222 (2017)
Baron, C.; Springer, H.; Raabe, D.: Combinatorial screening of the microstructure–property relationships for Fe–B–X stiff, light, strong and ductile steels. Materials and Design 112, pp. 131 - 139 (2016)
Baron, C.; Springer, H.; Raabe, D.: Effects of Mn additions on microstructure and properties of Fe–TiB2 based high modulus steels. Materials and Design 111, pp. 185 - 191 (2016)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.