Brink, T.; Bhat, M. K.; Best, J. P.; Dehm, G.: Grain-boundary segregation effects on bicrystal Cu pillar compression. DPG Spring Meeting, Dresden, Germany (2023)

Brink, T.: Atomistic simulations of grain boundary phases: From thermodynamics to mechanics. Seminar Materials Science and Technology at the Ruhr-Universität Bochum , Bochum, Germany (2023)

Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Deformation mechanism of complexions in a Cu grain boundary under shear. FEMS EUROMAT 2023, Frankfurt am Main, Germany (2023)

Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Disconnection activation in complexions of a Cu grain boundary under shear. 19th International Conference on Diffusion in Solids and Liquids (DSL-2023), Heraklion, Greece (2023)

Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Liebscher, C.; Dehm, G.: Diffusionless congruent grain boundary phase transitions in pure copper. The 10th International Conference on Multiscale Materials Modeling, Baltimore, MD, USA (2022)

Pemma, S.; Brink, T.; Janisch, R.; Dehm, G.: Stress driven grain boundary migration for different complexions of a Cu tilt grain boundary. Materials Science and Engineering Congress 2022, Darmstadt, Germany (2022)

Brink, T.; Frommeyer, L.; Ahmad, S.; Liebscher, C.; Dehm, G.: Grain boundary phase transitions in tilt grain boundaries of fcc metals: Atomistic simulation and experimental evidence. MSE Congress, Darmstadt, Germany (2022)

Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Liebscher, C.; Dehm, G.: Grain boundary phase transitions and patterning in a copper tilt grain boundary. DPG-Tagung, Regensburg, Germany (2022)

Dehm, G.; Langenohl, L.; Bishara, H.; Brink, T.; Liebscher, C.: Atomic structure and phase stability of Cu tilt grain boundaries resolved by scanning transmission electron microscopy. Materials Science and Engineering MSE Congress, Darmstadt, Germany (2022)

Brink, T.: Thermodynamics of grain boundary phases in fcc metals: Using atomistic simulations to augment and extend experimental insights. Materials Science Colloquium at the Technische Universität Darmstadt, Darmstadt, Germany (2022)

Frommeyer, L.; Brink, T.; Dehm, G.; Liebscher, C.: Atomic-scale observation of silver segregation in a high angle grain boundary in copper. DPG Tagung, Sektion kondensierte Materie, Regensburg, Germany (accepted)

Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Atomistic simulation study of grain boundary migration for different complexions in copper. DPG-Tagung, Virtual (2021)

Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Pemma, S.; Liebscher, C.; Dehm, G.: Diffusionless congruent grain boundary phase transitions in metals: Simulation and experimental imaging. 2021 Fall Meeting of the European Materials Research Society , Virtual (2021)

Brink, T.: From contact mechanics to wear. EPFL Summer School: Tribology and Surfaces Interactions, Visp, VS, Switzerland (2021)

Dehm, G.; Peter, N. J.; Meiners, T.; Frommeyer, L.; Brink, T.; Frolov, T.; Liebscher, C.: Grain boundary phases in pure and alloyed Cu: Insights from advanced STEM. Microscopy Conference 2021 Joint Meeting of Dreiländertagung & Multinational Congress on Microscopy, Virtual Meeting (2021)

Frommeyer, L.; Brink, T.; Freitas, R.; Frolov, T.; Dehm, G.; Liebscher, C.: Congruent grain boundary phase transformations revealed by STEM in pure copper. Microscopy conference Joint Meeting of Dreiländertagungn & Multinational Congress on Microscopy MC 2021, virtual, Vienna, Austria (2021)

Brink, T.; Dehm, G.: Atomistic simulation of grain boundary phases and transitions in fcc metals. DPG-Tagung, Virtual (2021)

Brink, T.; Frérot, L.; Milanese, E.; Molinari, J.-F.: Two views on physics-based wear laws: The nanoscale and the mesoscale. Vienna Virtual Materials Tribology Workshop, online (2021)

Frommeyer, L.; Brink, T.; Dehm, G.; Liebscher, C.: Inclinational dependence of atomic grain boundary structures in Copper. Digital Young Materials Researcher Day, RUB, virtual, Bochum, Germany (2020)

Saood, S.; Brink, T.; Liebscher, C.; Dehm, G.: Atomic structure of [111] tilt boundaries of Al in relation to their crystallographic parameters. International Microscopy Conference 2023 (IMC-20), Busan, South Korea (2023)