Song, J.; Kostka, A.; Veehmayer, M.; Raabe, D.: Hierarchical microstructure of explosive joints: Example of titanium to steel cladding. Materials Science and Engineering A 528, pp. 2641 - 2647 (2011)
Kostka, A.; Song, J.; Raabe, D.; Veehmayer, M.: Structural characterization and analysis of interface formed by explosion cladding of titanium to low carbon steel. 19th International Symposium on Metastable, Amorphous and Nanostructured Materials (ISMANAM), Moscow, Russia (2012)
Kostka, A.; Song, J.; Raabe, D.; Veehmayer, M.: Microstructure and properties of interfaces formed by explosion cladding of Ti-Steel. XXI Conference on Applied Crystallography, Zakopane, Poland (2009)
Kostka, A.; Song, J.; Raabe, D.; Veehmayer, M.: Microstructure and properties of interfaces formed by explosion cladding of Ti-Steel. XXI Conference on Applied Crystallography, Zakopane, Poland (2009)
Song, J.: Explosive Cladding of Titanium onto Low Carbon Steel. International SurMat Workshop, Department of Material Science and Engineering, Ruhr-Universität Bochum, Bochum, Germany (2008)
Song, J.: Microstructure and properties of interfaces formed by explosion cladding of Titanium to low Carbon steel. Dissertation, Ruhr-University Bochum, Bochum, Germany (2011)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
In this project we work on correlative atomic structural and compositional investigations on Co and CoNi-based superalloys as a part of SFB/Transregio 103 project “Superalloy Single Crystals”. The task is to image the boron segregation at grain boundaries in the Co-9Al-9W-0.005B alloy.