Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.: Film thickness effects on the deformation behavior of Cu/Cr thin films on polyimide. TMS 2014: 143rd Annual Meeting & Exhibition, San Diego, CA, USA (2014)
Dehm, G.: Shedding light on the role of interfaces for strengthening materials by using micromechanical testing. 60. Metallkunde-Jubiläumskolloquium, Lech am Arlberg, Germany (2014)
Dehm, G.: Cu–Cr nanocomposites and multilayers. Gordon Research Conference: Thin Film & Small Scale Mechanical Behavior, Bentley University, Boston, MA, USA (2014)
Dehm, G.: Localized mechanical study of individual interfaces in miniaturized Cu structures. MS&T14 - Materials Science & Technology 2014, Pittsburgh, PA, USA (2014)
Imrich, P. J.; Kirchlechner, C.; Motz, C.; Jeon, J. B.; Dehm, G.: In Situ Electron Microscopy and Micro-Laue Study of Plasticity in Miniaturized Cu Bicrystals. CAMTEC III, Symposium on Fine-Scale Mechanical Characterisation and Behaviour , Cambridge, UK (2014)
Kirchlechner, C.; Imrich, P. J.; Motz, C.; Dehm, G.: Plastic deformation of bi-crystalline micro pillars analyzed by in situ µLaue diffraction. TMS2014, Annual Meeting & Exhibition, San Diego, CA, USA (2014)
Pizzagalli, L.; Dehm, G.; Thomas, O.: Structure and dynamics V: Mechanical properties at small scales. Condensed Matter in Paris: Mini-colloquium 32, Paris, France (2014)
Dehm, G.: From idealized bi-crystals towards applied polycrystals: Plastic deformation in small dimensions. 2013 MRS Fall Meeting, Boston, MA, USA (2013)
Dehm, G.: Structure and Micromechanics of Materials. Materialwissenschaftliches Kolloquium ICAMS und Institut für Werkstoffe, RUB, Bochum, Germany (2013)
Dehm, G.: Probing deformation phenomena at small length scales. ECI on Nanomechanical Testing in Materials Research and Development IV, Olhão, Portugal (2013)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project we developed a phase-field model capable of describing multi-component and multi-sublattice ordered phases, by directly incorporating the compound energy CALPHAD formalism based on chemical potentials. We investigated the complex compositional pathway for the formation of the η-phase in Al-Zn-Mg-Cu alloys during commercial…
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
This project aims to investigate the influence of grain boundaries on mechanical behavior at ultra-high strain rates and low temperatures. For this micropillar compressions on copper bi-crystals containing different grain boundaries will be performed.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.