Hieke, S. W.; Willinger, M. G.; Wang, Z.-J.; Richter, G.; Dehm, G.; Scheu, C.: Evolution of faceted voids and fingering instabilities in a model thin film system - Insights by in-situ environmental scanning electron microscopy. Symposium - In situ Microscopy with Electrons, X‐rays and Scanning Probes, Universität Erlangen‐Nürnberg, Erlangen, Germany (2017)
Brinckmann, S.; Kirchlechner, C.; Dehm, G.; Matoy, K.: Using simulations to investigate the apparent fracture toughness of microcantilevers. Nanomechanical Testing in Materials Research and Development VI, Dubrovnik, Croatia (2017)
Arigela, V. G.; Kirchlechner, C.; Dehm, G.: Setup of a microscale high temperature loading rig for micro-fracture mechanics. Euromat 2017, Thessaloniki, Greece (2017)
Dehm, G.: Resolving the mechanical performance of materials in microelectronic components with µm spatial resolution. FIMPART - Frontiers in Materials Processing Applications, Research and Technology, Bordeaux, France (2017)
Duarte, M. J.; Fang, X.; Brinckmann, S.; Dehm, G.: In-situ nanoindentation of hydrogen bcc Fe–Cr charged surfaces: Current status and future perspectives. Frontiters in Material Science & Engineering workshop: Hydrogen Interaction in Metals, Max-Planck Institut für Eisenforschung, Düsseldorf, Germany (2017)
Brinckmann, S.; Fink, C.; Dehm, G.: Severe Microscale Deformation of Pearlite and Cementite. 2017 MRS Spring Meeting & Exhibits, Phoenix, AZ, USA (2017)
Luo, W.; Kirchlechner, C.; Dehm, G.; Stein, F.: Fracture Toughness of Hexagonal and Cubic NbCo2 Laves Phases. Nanobrücken 2017, European Nanomechanical Testing Conference, University of Manchester, Manchester, UK (2017)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project we developed a phase-field model capable of describing multi-component and multi-sublattice ordered phases, by directly incorporating the compound energy CALPHAD formalism based on chemical potentials. We investigated the complex compositional pathway for the formation of the η-phase in Al-Zn-Mg-Cu alloys during commercial…
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
This project aims to investigate the influence of grain boundaries on mechanical behavior at ultra-high strain rates and low temperatures. For this micropillar compressions on copper bi-crystals containing different grain boundaries will be performed.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.