Publications of Gerhard Dehm

Wimmer, A. C.; Heinz, W.; Detzel, T.; Robl, W.; Nellessen, M.; Kirchlechner, C.; Dehm, G.: Cyclic bending experiments on freestanding Cu micron lines observed by EBSD. Acta Materialia 83, pp. 460 - 469 (2015)

Zhang, Z.; Dehm, G.: Study on the Atomic and Electronic Structure in CrN (VN, TiN) Films using C_s-Corrected TEM. Microscopy and Microanalysis 21 (3), pp. 2079 - 2080 (2015)

Brinckmann, S.; Völker, B.; Dehm, G.: Crack deflection in multi-layered four-point bending samples. International Journal of Fracture 190 (1-2), pp. 167 - 176 (2014)

Wimmer, A. C.; Smółka, M. N.; Heinz, W.; Detzel, T.; Robl, W.; Motz, C.; Eyert, V.; Wimmer, E.; Jahnel, F.; Treichler, R. et al.; Dehm, G.: Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 618, pp. 398 - 405 (2014)

Rashkova, B.; Faller, M.; Pippan, R.; Dehm, G.: Growth mechanism of Al₂Cu precipitates during in situ TEM heating of a HPT deformed Al–3wt.%Cu alloy. Journal of Alloys and Compounds 600, pp. 43 - 50 (2014)

Imrich, P. J.; Kirchlechner, C.; Motz, C.; Dehm, G.: Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary. Acta Materialia 73, pp. 240 - 250 (2014)

Wimmer, A.; Leitner, A.; Detzel, T.; Robl, W.; Heinz, W.; Pippan, R.; Dehm, G.: Damage evolution during cyclic tension-tension loading of micron-sized Cu lines. Acta Materialia 67, pp. 297 - 307 (2014)

Li, J.; Wimmer, A.; Dehm, G.; Schumacher, P.: Intermetallic phase selection during homogenisation for AA6082 alloy. Philosophical Magazine 94 (8), pp. 830 - 846 (2014)

Harzer, T. P.; Daniel, R.; Mitterer, C.; Dehm, G.; Zhang, Z. L.: Transmission electron microscopy characterization of CrN films on MgO(001). Thin Solid Films 545, pp. 154 - 160 (2013)

Daum, B.; Dehm, G.; Clemens, H.; Rester, M.; Fischer, F. D.; Rammerstorfer, F. G.: Elastoplastic buckling as source of misinterpretation of micropillar tests. Acta Materialia 61 (13), pp. 4996 - 5007 (2013)

Gamsjäger, E.; Liu, Y.; Rester, M.; Puschnig, P.; Draxl, C.; Clemens, H. J.; Dehm, G.; Fischer, F. D.: Diffusive and massive phase transformations in Ti–Al–Nb alloys-Modelling and experiments. Intermetallics 38, pp. 126 - 138 (2013)

Taylor, A. A.; Cordill, M. J.; Bowles, L.; Schalko, J.; Dehm, G.: An elevated temperature study of a Ti adhesion layer on polyimide. Thin Solid Films 531, pp. 354 - 361 (2013)

Li, L. L.; An, X. H.; Imrich, P. J.; Zhang, P.; Zhang, Z. J.; Dehm, G.; Zhang, Z. F.: Microcompression and cyclic deformation behaviors of coaxial copper bicrystals with a single twin boundary. Scripta Materialia 69, pp. 199 - 202 (2013)

Zhang, Z.; Li, H.; Daniel, R.; Mitterer, C.; Dehm, G.: Insights into the atomic and electronic structure triggered by ordered nitrogen vacancies in CrN. Physical Review B 87 (1), pp. 014104-1 - 014104-9 (2013)

Dehm, G.: Schlüsseltechnologie der Zukunft. Das Forschungsmagazin der ÖAW 11, p. 38 (2012)

Li, J.; Zarif, M. Z.; Dehm, G.; Schumacher, P.: Influence of impurity elements on the nucleation and growth of Si in high purity melt-spun Al–Si-based alloys. Philosophical Magazine 92 (31), pp. 3789 - 3805 (2012)

Cordill, M. J.; Taylor, A. A.; Berger, J.; Schmidegg, K.; Dehm, G.: Robust mechanical performance of chromium-coated polyethylene terephthalate over a broad range of conditions. Philosophical Magazine 92 (25-27), pp. 3346 - 3362 (2012)

Kirchlechner, C.; Grosinger, W.; Kapp, M. W.; Imrich, P. J.; Micha, J.-S.; Ulrich, O.; Kečkéš, J.; Dehm, G.; Motz, C.: Investigation of reversible plasticity in a micron-sized, single crystalline copper bending beam by X-ray μLaue diffraction. Philosophical Magazine 92 (25-27), pp. 3231 - 3242 (2012)

Taylor, A. A.; Cordill, M. J.; Dehm, G.: On the limits of the interfacial yield model for fragmentation testing of brittle films on polymer substrates. Philosophical Magazine 92 (25-27), pp. 3363 - 3380 (2012)

Yang, B.; Motz, C.; Rester, M.; Dehm, G.: Yield stress influenced by the ratio of wire diameter to grain size – a competition between the effects of specimen microstructure and dimension in micro-sized polycrystalline copper wires. Philosophical Magazine Letters; Nano-mechanical testing in materials research and development III 92 (25-27), pp. 3243 - 3256 (2012)