Volkert, C. A.; Busch, S.; Heiland, B.; Dehm, G.: Transmission electron microscopy of fluorapatite-gelatine composite particles prepared using focused ion beam milling. Journal of Microscopy 214 (3), pp. 208 - 212 (2004)
Schmidt, T.; Balk, T. J.; Dehm, G.; Arzt, E.: Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates. Scripta Materialia 50 (6), pp. 733 - 737 (2004)
Inkson, B. J.; Dehm, G.; Wagner, T. A.: Thermal stability of Ti and Pt nanowires manufactured by Ga+ focused ion beam. Journal of Microscopy 214 (3), pp. 252 - 260 (2004)
Dehm, G.; Inkson, B. J.; Wagner, T. A.: Growth and microstructural stability of epitaxial Al films on (0001) α-Al2O3 substrates. Acta Materialia 50 (20), pp. 5021 - 5032 (2002)
Inkson, B. J.; Dehm, G.; Wagner, T. A.: In-situ TEM observation of dislocation motion in thermally strained Al nanowires. Acta Materialia 50 (20), pp. 5033 - 5047 (2002)
Beschliesser, M.; Chatterjee, A.; Lorich, A.; Knabl, W.; Kestler, H.; Dehm, G.; Clemens, H.: Designed fully lamellar microstructures in a γ-TiAl based alloy: adjustment and microstructural changes upon long-term isothermal exposure at 700 and 800 degrees C. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing 329-331, pp. 124 - 129 (2002)
Dehm, G.; Balk, T. J.; von Blanckenhagen, B.; Gumbsch, P.; Arzt, E.: Dislocation dynamics in sub-micron confinement: recent progress in Cu thin film plasticity. Zeitschrift für Metallkunde/Materials Research and Advanced Techniques 93 (5), pp. 383 - 391 (2002)
Schillinger, W.; Clemens, H.; Dehm, G.; Bartels, A.: Microstructural stability and creep behavior of a lamellar γ-TiAl based alloy with extremely fine lamellar spacing. Intermetallics 10 (5), pp. 459 - 466 (2002)
Bartels, A.; Clemens, H.; Dehm, G.; Lach, E.; Schillinger, W.: Strain rate dependence of the deformation mechanisms in a fully lamellar γ-TiAl-based alloy. Zeitschrift für Metallkunde/Materials Research and Advanced Techniques 93 (3), pp. 180 - 185 (2002)
Dehm, G.; Wagner, T. A.; Balk, T. J.; Arzt, E.; Inkson, B. J.: Plasticity and interfacial dislocation mechanisms in epitaxial and polycrystalline Al films constrained by substrates. Journal of Materials Science & Technology 18 (2), pp. 113 - 117 (2002)
Kobrinsky, M. J.; Dehm, G.; Thompson, C. L.; Arzt, E.: Effects of thickness on the characteristic length scale of dislocation plasticity in Ag thin films. Acta Materialia 49 (17), pp. 3597 - 3607 (2001)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project we developed a phase-field model capable of describing multi-component and multi-sublattice ordered phases, by directly incorporating the compound energy CALPHAD formalism based on chemical potentials. We investigated the complex compositional pathway for the formation of the η-phase in Al-Zn-Mg-Cu alloys during commercial…
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
This project aims to investigate the influence of grain boundaries on mechanical behavior at ultra-high strain rates and low temperatures. For this micropillar compressions on copper bi-crystals containing different grain boundaries will be performed.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.