Dehm, G.: Mikromechanik: lokale Einblicke in die mechanischen Eigenschaften von Materialien. Eröffnung des Christian Doppler Labors für
Lebensdauer und Zuverlässigkeit von Grenzflächen in komplexen Mehrlagenstrukturen der Elektronik „RELAB“, Vienna, Austria (2015)
Dehm, G.: New insights into the mechanical behavior of interface controlled metals. Colloquium Materials Modelling, Institut für Materialprüfung, Werkstoffkunde und Festigkeitslehre (IMWF), Universität Stuttgart , Stuttgart, Germany (2015)
Dehm, G.; Imrich, P. J.; Malyar, N.; Kirchlechner, C.: Differences in deformation behavior of bicrystalline Cu micropillars containing different grain boundaries. MS&T 2015 (Materials Science and Technology) meeting, symposium entitled "Deformation and Transitions at Grain Boundaries", Columbus, OH, USA (2015)
Dehm, G.; Zhang, Z.; Völker, B.: Structure and strength of metal-ceramic interfaces: New insights by Cs corrected TEM and advances in miniaturized mechanical testing. MS&T 2015 (Materials Science and Technology) meeting, Symposium entitled "Structures and Properties of Grain Boundaries: Towards an atomic-scale understanding of ceramics", Columbus, OH, USA (2015)
Dehm, G.; Harzer, T. P.; Völker, B.; Imrich, P. J.; Zhang, Z.: Towards New Insights on Interface Controlled Materials by Advanced Electron Microscopy. Frontiers of Electron Microscopy in Materials Science Meeting (FEMMS 2015), Lake Tahoe, CA, USA (2015)
Dehm, G.; Jaya, B. N.; Raghavan, R.; Kirchlechner, C.: Probing deformation and fracture of materials with high spatial resolution. Euromat 2015 - Symposium on In-situ Micro- and Nano-mechanical, Characterization and Size Effects
, Warsaw, Poland (2015)
Dehm, G.: In situ nano- and micromechanics of materials. International Workshop on Advanced and In-situ Microscopies of Functional Nanomaterials and Devices – IAMNano 2015, Hamburg, Germany (2015)
Duarte, M. J.; Brinckmann, S.; Renner, F. U.; Dehm, G.: Nanomechanical testing under environmental conditins of Fe-based metallic glasses. 22st International Symposium on Metastable Amorphous and Nanostructured Materials, ISMANAM 2015, Paris, France (2015)
Hieke, S. W.; Dehm, G.; Scheu, C.: Temperature induced faceted hole formation in epitaxial Al thin films on sapphire. Understanding Grain Boundary Migration: Theory Meets Experiment, Günzburg/Donau, Germany (2015)
Malyar, N.; Kirchlechner, C.; Dehm, G.: Dislocation grain boundary interaction in bi-crystalline micro pillars studied by in situ SEM and in situ µLaue diffraction. ICM 12 - 12th International Conference on the Mechanical Behavior of Materials, Karlsruhe, Germany (2015)
Dehm, G.: In situ nanocompression testing in the TEM: Challenges and benefits. Symposium Advanced Electron Microscopy for Materials Research, Erlangen, Germany (2015)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
In this project we work on correlative atomic structural and compositional investigations on Co and CoNi-based superalloys as a part of SFB/Transregio 103 project “Superalloy Single Crystals”. The task is to image the boron segregation at grain boundaries in the Co-9Al-9W-0.005B alloy.
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.