Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.: Film thickness effects on the deformation behavior of Cu/Cr thin films on polyimide. TMS 2014: 143rd Annual Meeting & Exhibition, San Diego, CA, USA (2014)
Cordill, M. J.; Glushko, O.; Kreith, J.; Marx, V. M.; Kirchlechner, C.; Zizak, I.; Struntz, T.; Fantner, E.: In-situ squared: multi property thin film measurements during straining. Nano- and Micromechanical Testing in Materials Research and Development IV, Olhão, Portugal (2013)
Marx, V. M.; Kirchlechner, C.; Cordill, M. J.; Dehm, G.: Deformation behavior of a Cr interlayer buried under Cu films on polyimide. GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPIE, Düsseldorf, Germany (2013)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Deformation behavior of thin Cu/Cr films on polyimide. Small Scale Plasticity School, Cargèse, Corsica, France (2013)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion behavior of Cu–Cr thin films on polyimide substrate. ECI Conference "Nano- and Micro-Mechanical Testing in Materials Research and Development IV", Olhão, Portugal (2013)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion Behavior of Cu–Cr Thin Films on Polyimide Substrate. TMS 2013: 142nd Annual Meeting & Exhibition, San Antonio, TX, USA (2013)
Cordill, M. J.; Marx, V. M.: In-situ Tensile Straining of Metal Films on Polymer Substrates under an AFM. 2012 MRS Fall Meeting & Exhibit, Hynes Convention Center, Boston, MA, USA (2012)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Dehm, G.; Cordill, M. J.: In-situ fracture study of thin Cu films on polyimide substrate. GDRi MECANO General Meeting 2012, Ecole de Mines, Paris, France (2012)
Marx, V. M.: The mechanical behavior of thin metallic films on flexible polymer substrate. Dissertation, Ruhr-Universität Bochum, Bochum, Germany (2016)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
This project aims to investigate the influence of grain boundaries on mechanical behavior at ultra-high strain rates and low temperatures. For this micropillar compressions on copper bi-crystals containing different grain boundaries will be performed.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.
This project aims to investigate the dynamic hardness of B2-iron aluminides at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1 and study the microstructure evolution across strain rate range.