Inkson, B. J.; Dehm, G.; Peng, Y.: Dynamical growth of Cu-Pt nanowires with a nanonecklace morphology. Nanotechnology 18 (41), 415601, pp. 1 - 5 (2007)
Oh, S. H.; Legros, M.; Kiener, D.; Gruber, P. A.; Dehm, G.: In situ TEM straining of single crystal Au films on polyimide: Change of deformation mechanisms at the nanoscale. Acta Materialia 55 (16), pp. 5558 - 5571 (2007)
Kiener, D.; Motz, C.; Rester, M.; Jenko, M.; Dehm, G.: FIB damage of Cu and possible consequences for miniaturized mechanical tests. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 459 (1-2), pp. 262 - 272 (2007)
Kiener, D.; Motz, C.; Schöberl, T.; Jenko, M.; Dehm, G.: Determination of mechanical properties of copper at the micron scale. Advanced Engineering Materials 8 (11), pp. 1119 - 1125 (2006)
Riethmüller, J.; Dehm, G.; Affeldt, E. E.; Arzt, E.: Microstructure and mechanical behavior of Pt-modified NiAl diffusion coatings. International Journal of Materials Research 97 (6), pp. 689 - 698 (2006)
Wetscher, F.; Pippan, R.; Šturm, S.; Kauffmann, F.; Scheu, C.; Dehm, G.: TEM investigation of the structural evolution in a pearlitic steel deformed by high pressure torsion. Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science 37 (6), pp. 1963 - 1968 (2006)
Kauffmann, F.; Ji, B.; Dehm, G.; Gao, H.; Arzt, E.: A quantitative study of the hardness in a superhard nanocrystalline titanium nitride/silicon nitride coating. Scripta Materialia 52 (12), pp. 1269 - 1274 (2005)
Dehm, G.; Edongué, H.; Wagner, T. A.; Oh, S. H.; Arzt, E.: Obtaining different orientation relationships for Cu films grown on (0001) α-Al2O3 substrates by magnetron sputtering. Zeitschrift für Metallkunde 96 (3), pp. 249 - 254 (2005)
Sauter, L. X.; Balk, T. J.; Dehm, G.; Nucci, J.; Arzt, E.: Hillock Formation and Thermal Stresses in Thin Au Films on Si Substrates. Materials Research Society Symposium Proceedings 875, O5.2, pp. 177 - 182 (2005)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project we developed a phase-field model capable of describing multi-component and multi-sublattice ordered phases, by directly incorporating the compound energy CALPHAD formalism based on chemical potentials. We investigated the complex compositional pathway for the formation of the η-phase in Al-Zn-Mg-Cu alloys during commercial…
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
This project aims to investigate the influence of grain boundaries on mechanical behavior at ultra-high strain rates and low temperatures. For this micropillar compressions on copper bi-crystals containing different grain boundaries will be performed.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.