Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion Behavior of Cu–Cr Thin Films on Polyimide Substrate. TMS 2013: 142nd Annual Meeting & Exhibition, San Antonio, TX, USA (2013)
Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints for automotive microelectronics. Nano- and Micromechanical Testing in Materials Research and Development IV, Olhão Algarve, Portugal (2013)
Harzer, T. P.; Dehm, G.: Microstructural studies of Cu–Cr thin film structures grown by molecular beam epitaxy using advanced transmission electron microscopy. Macan Theromodynamics Workshop, Istanbul, Turkey (2012)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Dehm, G.; Cordill, M. J.: In-situ fracture study of thin Cu films on polyimide substrate. GDRi MECANO General Meeting 2012, Ecole de Mines, Paris, France (2012)
Eiper, E.; Martinschitz, K. J.; Dehm, G.; Kečkéš, J.: Size effect in metallic thin films characterized by low-temperature X-ray diffraction. Gordon Research Conference on thin film & smallscale mechanical behavior , Colby College Waterville, Maine, USA (2006)
Rester, M.; Kiener, D.; Kreuzer, H. G.M.; Dehm, G.; Motz, C.: Microstructural investigation of the deformation zone below nanoindents in copper, silver and nickel. Hysitron Workshop and Usermeeting, München, Germany (2006)
Max Planck team explains dendrite propagation, paving the way for safer and longer-lasting next-generation batteries. They publish their findings in the journal Nature.
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
This project aims to investigate the dynamic hardness of B2-iron aluminides at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1 and study the microstructure evolution across strain rate range.