Singh, M. P.; Woods, E.; Kim, S.-H.; Jung, C.; Aota, L. S.; Gault, B.: Facilitating the Systematic Nanoscale Study of Battery Materials by Atom Probe Tomography through in-situ Metal Coating. Batteries & Supercaps 7 (2), e202300403 (2023)
Jung, C.; Jun, H.; Jang, K.; Kim, S.-H.; Choi, P.-P.: Tracking the Mn Diffusion in the Carbon-Supported Nanoparticles Through the Collaborative Analysis of Atom Probe and Evaporation Simulation. Microscopy and Microanalysis 28 (6), pp. 1841 - 1850 (2022)
Zhang, S.; Yu, Y.; Jung, C.; Mattlat, D. A.; Abdellaoui, L.; Scheu, C.: In situ STEM observation of thermoelectric materials under heating and biasing conditions. The 6th joint Sino-German workshop on advanced & correlative electron microscopy of catalysts, quantum phenomena & soft matter, Bad Honnef, Germany (2024)
Zhang, S.; Yu, Y.; Jung, C.; Wang, Z.; Mattlat, D. A.; Abdellaoui, L.; Scheu, C.: In situ microstructural observation and electrical transport measurements of PbTe thermoelectrics by transmission electron microscopy. International Conference on Thermoelectrics ICT, Krakow, Poland (2024)
Bhat, M. K.; Brink, T.; Ding, H.; Jung, C.; Best, J. P.; Dehm, G.: Influence of the Structure and Chemistry of Σ5 Grain Boundaries on Microscale Strengthening in Cu Bicrystals. TMS Annual Meeting and Exhibition 2024, Orlando, FL, USA (2024)
Jung, C.: Understanding of the property-structure relationship for thermoelectric materials through advanced characterization. Korea Electrotechnology Research Institute, Changwon, South Korea (2023)
Jung, C.: Investigation of interface between CIGS and buffer layer using atom probe tomography. Korea Institute of Energy Research, Daejeon, South Korea (2023)
Jung, C.: NbCoSn based half-Heusler compounds through crystallization of amorphous precursors. Kyungpook National University, Daegu, South Korea (2023)
Jung, C.: Sample preparation of nanomaterials for atom probe analysis. NRF-DFG meeting “Electrodes for direct sea-water splitting and microstructure based stability analyses”, Korean Institute for Energy Research, Jeju, South Korea (2023)
Jung, C.: NbCoSn half-Heusler compounds through crystallization of amorphous precursors. Korea Institute of Ceramic Engineering and Technology, Jinju, South Korea (2023)
Jung, C.; Jang, K.; Zhang, S.; Bueno Villoro, R.; Choi, P.-P.; Scheu, C.: Sb-doping induced order to disorder transition enhances the thermal stability of NbCoSn1-xSbx half-Heusler semiconductors. The 20th International Microscopy Congress, PS-07.2. Microscopy of Semiconductor Materials and Devices, Busan, Republic of Korea (2023)
Zhang, S.; Yu, Y.; Jung, C.; Abdellaoui, L.; Scheu, C.: In situ TEM unveils dynamic doping behavior of thermoelectric materials – Microstructure and property evolution under heating and electric biasing. International Microscopy Conference IMC20, Busan, Korea (2023)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…