Diehl, M.: Crystal Plasticity Simulations on Real Data: Towards Highly Resolved 3D Microstructures. Seminar des Instituts für Mechanik, KIT, Karlsruhe, Germany (2016)
Roters, F.; Diehl, M.; Shanthraj, P.: Crystal Plasticity Simulations - Fundamentals, Implementation, Application. Micromechanics of Materials, Zernike Institute for Advanced Materials, University of Groningen
, Groningen, The Netherlands (2016)
Roters, F.; Diehl, M.; Shanthraj, P.: DAMASK Evolving From a Crystal Plasticity Subroutine Towards a Multi-Physics Simulation Tool. Focus Group Meeting “Metals”, SPP 1713, Bad Herrenalb, Germany (2016)
Roters, F.; Zhang, C.; Eisenlohr, P.; Shanthraj, P.; Diehl, M.: On the usage of HDF5 in the DAMASK crystal plasticity toolkit. 2nd International Workshop on Software Solutions for Integrated Computational Materials Engineering - ICME 2016, Barcelona, Spain (2016)
Cereceda, D.; Diehl, M.; Roters, F.; Raabe, D.; Perlado, J. M.; Marian, J.: An atomistically-informed crystal plasticity model to predict the temperature dependence of the yield strength of single-crystal tungsten. XXV International Workshop on Computational Micromechanics of Materials, Bochum, Germany (2015)
Diehl, M.; Eisenlohr, P.; Roters, F.; Shanthraj, P.; Reuber, J. C.; Raabe, D.: DAMASK: The Düsseldorf Advanced Material Simulation Kit for studying crystal plasticity using an FE based or a spectral numerical solver. Seminar of the Centro Nacional de Investigaciones Metalúrgicas (CENIM) del CSIC , Madrid, Spain (2015)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…