International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.
This project aims to develop a micromechanical metrology technique based on thin film deposition and dewetting to rapidly assess the dynamic thermomechanical behavior of multicomponent alloys. This technique can guide the alloy design process faster than the traditional approach of fabrication of small-scale test samples using FIB milling and…