Sevlikar, S. V.; Muralikrishna, G. M.; Gaertner, D.; Starikov, S.; Brink, T.; Scheiber, D.; Smirnova, D.; Irmer, D.; Tas, B.; Esin, V. A.et al.; Razumovskiy, V. I.; Liebscher, C.; Wilde, G.; Divinski, S. V.: Grain boundary diffusion and segregation of Cr in Ni Σ11(1̄13)[110] bicrystals: Decoding the role of grain boundary defects. Acta Materialia 278, 120229 (2024)
Ahmad, S.; Brink, T.; Liebscher, C.; Dehm, G.: Influence of variation in grain boundary parameters on the evolution of atomic structure and properties of [111] tilt boundaries in aluminum. Acta Materialia 268, 119732 (2024)
Torres, P. A. L.; Li, Y.-S.; Grön, C.; Lazaridis, T.; Watermeyer, P.; Cheng, N.; Liebscher, C.; Gasteiger, H. A.: ORR Activity and Voltage-Cycling Stability of a Carbon-Supported PtxY Alloy Catalyst Evaluated in a PEM Fuel Cell. Journal of the Electrochemical Society 170 (12), 124503 (2023)
Leitherer, A.; Yeo, B. C.; Liebscher, C.; Ghiringhelli, L. M.: Automatic identification of crystal structures and interfaces via artificial-intelligence-based electron microscopy. npj Computational Materials 9 (1), 179 (2023)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
This project aims to investigate the influence of grain boundaries on mechanical behavior at ultra-high strain rates and low temperatures. For this micropillar compressions on copper bi-crystals containing different grain boundaries will be performed.