Baron, C.; Springer, H.; Raabe, D.: Efficient liquid metallurgy synthesis of Fe–TiB2 high modulus steels via in-situ reduction of titanium oxides. Materials and Design 97, pp. 357 - 363 (2016)
Tarzimoghadam, Z.; Rohwerder, M.; Merzlikin, S. V.; Bashir, A.; Yedra , L.; Eswara, S.; Ponge, D.; Raabe, D.: Multi-scale and spatially resolved hydrogen mapping in a Ni–Nb model alloy reveals the role of the δ phase in hydrogen embrittlement of alloy 718. Acta Materialia 109, pp. 69 - 81 (2016)
Cereceda, D.; Diehl, M.; Roters, F.; Raabe, D.; Perlado, J. M.; Marian, J.: Unraveling the temperature dependence of the yield strength in single-crystal tungsten using atomistically-informed crystal plasticity calcula- tions. International Journal of Plasticity 78, pp. 242 - 265 (2016)
Springer, H.; Belde, M. M.; Raabe, D.: Combinatorial design of transitory constitution steels: Coupling high strength with inherent formability and weldability through sequenced austenite stability. Materials and Design 90, pp. 1100 - 1109 (2016)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…