Rabe, M.; Toparli, C.; Chen, Y.-H.; Kasian, O.; Mayrhofer, K. J. J.; Erbe, A.: Alkaline manganese electrochemistry studied by in situ and operando spectroscopic methods - metal dissolution, oxide formation and oxygen evolution. Physical Chemistry Chemical Physics 21 (20), pp. 10457 - 10469 (2019)
Toparli, C.; Ebin, B.; Gürmen, S.: Synthesis, structural and magnetic characterization of soft magnetic nanocrystalline ternary FeNiCo particles. Journal of Magnetism and Magnetic Materials 423, pp. 133 - 139 (2017)
Toparli, C.; Sarfraz, A.; Erbe, A.: A new look at oxide formation at the copper/electrolyte interface by in situ spectroscopies. Physical Chemistry Chemical Physics 17, pp. 31670 - 31679 (2015)
Erbe, A.; Nayak, S.; Chen, Y.-H.; Niu, F.; Pander, M.; Tecklenburg, S.; Toparli, C.: How to probe structure, kinetics and dynamics at complex interfaces in situ and operando by optical spectroscopy. In: Encyclopedia of Interfacial Chemistry: Surface Science and Electrochemistry; part of "Reference Module in Chemistry, Molecular Sciences and Chemical Engineering", pp. 199 - 219 (Ed. Wandelt, K.). Elsevier, Waltham, MA, USA (2017)
Toparli, C.: Passivity and passivity breakdown on copper: In situ and operando observation of surface oxides. Dissertation, Ruhr-Universität Bochum, Fakultät Maschinenbau, Bochum, Germany (2017)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Hydrogen in aluminium can cause embrittlement and critical failure. However, the behaviour of hydrogen in aluminium was not yet understood. Scientists at the Max-Planck-Institut für Eisenforschung were able to locate hydrogen inside aluminium’s microstructure and designed strategies to trap the hydrogen atoms inside the microstructure. This can…
This ERC-funded project aims at developing an experimentally validated multiscale modelling framework for the prediction of fracture toughness of metals.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…