Jeon, J. B.; Imrich, P. J.; Dehm, G.: Dislocation network formation in coherent twin boundary in Cu: Atomistic simulations. Schöntal symposium on dislocation-based plasticity, Bad Schöntal, Germany (2014)
Djaziri, S.; Li, Y.; Goto, S.; Kirchlechner, C.; Raabe, D.; Dehm, G.: Microstructural characterization of cold-drawn pearlitic steel wires at the nanometer scale. The Thin Film & Small Scale Mechanical Behavior Gordon Research Conference, Waltham, MA, USA (2014)
Fink, C.; Brinckmann, S.; Dehm, G.: Nanotribology and Microstructure Evolution in Pearlite. 3rd European Symposium on Friction, Wear and Wear Protection, Karlsruhe, Germany (2014)
Malyar, N.; Dehm, G.; Kirchlechner, C.: Dislocation motion in bi-crystals with a specific grain boundary orientation studied by in situ SEM and in situ µLaue diffraction. Conference: Thin Film & Small Scale Mechanical Behavior Gordon Research , Waltham, MA, USA (2014)
Malyar, N.; Dehm, G.; Kirchlechner, C.: Dislocation motion in bi-crystals with a specific grain boundary orientation studied by in situ SEM and in situ µLaue diffraction. Seminar: Thin Film & Small Scale Mechanical Behavior Gordon Research , Waltham, MA, USA (2014)
Philippi, B.; Kirchlechner, C.; Schießl, A.; Schingale, A.; Dehm, G.: Improving lead-free solders by resolving mechanical properties at the microstructure length scale. Thin Film & Small Scale Mechanical Behavior 2014, Gordon Research Conference, Waltham, MA, USA (2014)
Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Fracture behavior of gradient PtNiAl bond coats at the micron-scale using in-situ microbeam bend studies. 13th European Nanomechanical User Group Meeting, Oxford, UK (2013)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Deformation behavior of thin Cu/Cr films on polyimide. Small Scale Plasticity School, Cargèse, Corsica, France (2013)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion behavior of Cu–Cr thin films on polyimide substrate. ECI Conference "Nano- and Micro-Mechanical Testing in Materials Research and Development IV", Olhão, Portugal (2013)
Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints in automotive microelectronics. GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPIE, Düsseldorf, Germany (2013)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion Behavior of Cu–Cr Thin Films on Polyimide Substrate. TMS 2013: 142nd Annual Meeting & Exhibition, San Antonio, TX, USA (2013)
Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints for automotive microelectronics. Nano- and Micromechanical Testing in Materials Research and Development IV, Olhão Algarve, Portugal (2013)
Harzer, T. P.; Dehm, G.: Microstructural studies of Cu–Cr thin film structures grown by molecular beam epitaxy using advanced transmission electron microscopy. Macan Theromodynamics Workshop, Istanbul, Turkey (2012)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Dehm, G.; Cordill, M. J.: In-situ fracture study of thin Cu films on polyimide substrate. GDRi MECANO General Meeting 2012, Ecole de Mines, Paris, France (2012)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the current study is to investigate electrochemical corrosion mechanisms by examining the metal-liquid nanointerfaces. To achieve this, corrosive fluids will be strategically trapped within metal structures using novel additive micro fabrication techniques. Subsequently, the nanointerfaces will be analyzed using cryo-atom probe…
TiAl-based alloys currently mature into application. Sufficient strength at high temperatures and ductility at ambient temperatures are crucial issues for these novel light-weight materials. By generation of two-phase lamellar TiAl + Ti3Al microstructures, these issues can be successfully solved. Because oxidation resistance at high temperatures is…
We plan to investigate the rate-dependent tensile properties of 2D materials such as metal thin films and PbMoO4 (PMO) films by using a combination of a novel plan-view FIB based sample lift out method and a MEMS based in situ tensile testing platform inside a TEM.
The main aspect of this project is to understand how hydrogen interacts with dislocations/ stacking faults at the stress concentrated crack tip. A three-point bending test has been employed for this work.