Daum, B.; Dehm, G.; Clemens, H.; Rester, M.; Fischer, F. D.; Rammerstorfer, F. G.: Elastoplastic buckling as source of misinterpretation of micropillar tests. Acta Materialia 61 (13), pp. 4996 - 5007 (2013)
Taylor, A. A.; Cordill, M. J.; Bowles, L.; Schalko, J.; Dehm, G.: An elevated temperature study of a Ti adhesion layer on polyimide. Thin Solid Films 531, pp. 354 - 361 (2013)
Li, L. L.; An, X. H.; Imrich, P. J.; Zhang, P.; Zhang, Z. J.; Dehm, G.; Zhang, Z. F.: Microcompression and cyclic deformation behaviors of coaxial copper bicrystals with a single twin boundary. Scripta Materialia 69, pp. 199 - 202 (2013)
Zhang, Z.; Li, H.; Daniel, R.; Mitterer, C.; Dehm, G.: Insights into the atomic and electronic structure triggered by ordered nitrogen vacancies in CrN. Physical Review B 87 (1), pp. 014104-1 - 014104-9 (2013)
Li, J.; Zarif, M. Z.; Dehm, G.; Schumacher, P.: Influence of impurity elements on the nucleation and growth of Si in high purity melt-spun Al–Si-based alloys. Philosophical Magazine 92 (31), pp. 3789 - 3805 (2012)
Cordill, M. J.; Taylor, A. A.; Berger, J.; Schmidegg, K.; Dehm, G.: Robust mechanical performance of chromium-coated polyethylene terephthalate over a broad range of conditions. Philosophical Magazine 92 (25-27), pp. 3346 - 3362 (2012)
Taylor, A. A.; Cordill, M. J.; Dehm, G.: On the limits of the interfacial yield model for fragmentation testing of brittle films on polymer substrates. Philosophical Magazine 92 (25-27), pp. 3363 - 3380 (2012)
Yang, B.; Motz, C.; Rester, M.; Dehm, G.: Yield stress influenced by the ratio of wire diameter to grain size – a competition between the effects of specimen microstructure and dimension in micro-sized polycrystalline copper wires. Philosophical Magazine Letters; Nano-mechanical testing in materials research and development III 92 (25-27), pp. 3243 - 3256 (2012)
Heinz, W.; Dehm, G.: Grain resolved orientation changes and texture evolution in a thermally strained Al film on Si substrate. Surface and Coatings Technology 206 (7), pp. 1850 - 1854 (2011)
Taylor, A. A.; Edlmayr, V.; Cordill, M. J.; Dehm, G.: The effect of temperature and strain rate on the periodic cracking of amorphous AlxOy films on Cu. Surface and Coatings Technology 206 (7), pp. 1855 - 1859 (2011)
Taylor, A. A.; Edlmayr, V.; Cordill, M. J.; Dehm, G.: The effect of film thickness variations in periodic cracking: Analysis and experiments. Surface and Coatings Technology 206 (7), pp. 1830 - 1836 (2011)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…