Zhang, Z.; Dehm, G.: Study on the Atomic and Electronic Structure in CrN (VN, TiN) Films using Cs-Corrected TEM. Microscopy and Microanalysis 21 (3), pp. 2079 - 2080 (2015)
Rashkova, B.; Faller, M.; Pippan, R.; Dehm, G.: Growth mechanism of Al2Cu precipitates during in situ TEM heating of a HPT deformed Al–3wt.%Cu alloy. Journal of Alloys and Compounds 600, pp. 43 - 50 (2014)
Imrich, P. J.; Kirchlechner, C.; Motz, C.; Dehm, G.: Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary. Acta Materialia 73, pp. 240 - 250 (2014)
Harzer, T. P.; Daniel, R.; Mitterer, C.; Dehm, G.; Zhang, Z. L.: Transmission electron microscopy characterization of CrN films on MgO(001). Thin Solid Films 545, pp. 154 - 160 (2013)
Daum, B.; Dehm, G.; Clemens, H.; Rester, M.; Fischer, F. D.; Rammerstorfer, F. G.: Elastoplastic buckling as source of misinterpretation of micropillar tests. Acta Materialia 61 (13), pp. 4996 - 5007 (2013)
Taylor, A. A.; Cordill, M. J.; Bowles, L.; Schalko, J.; Dehm, G.: An elevated temperature study of a Ti adhesion layer on polyimide. Thin Solid Films 531, pp. 354 - 361 (2013)
Li, L. L.; An, X. H.; Imrich, P. J.; Zhang, P.; Zhang, Z. J.; Dehm, G.; Zhang, Z. F.: Microcompression and cyclic deformation behaviors of coaxial copper bicrystals with a single twin boundary. Scripta Materialia 69, pp. 199 - 202 (2013)
Zhang, Z.; Li, H.; Daniel, R.; Mitterer, C.; Dehm, G.: Insights into the atomic and electronic structure triggered by ordered nitrogen vacancies in CrN. Physical Review B 87 (1), pp. 014104-1 - 014104-9 (2013)
Li, J.; Zarif, M. Z.; Dehm, G.; Schumacher, P.: Influence of impurity elements on the nucleation and growth of Si in high purity melt-spun Al–Si-based alloys. Philosophical Magazine 92 (31), pp. 3789 - 3805 (2012)
Cordill, M. J.; Taylor, A. A.; Berger, J.; Schmidegg, K.; Dehm, G.: Robust mechanical performance of chromium-coated polyethylene terephthalate over a broad range of conditions. Philosophical Magazine 92 (25-27), pp. 3346 - 3362 (2012)
Taylor, A. A.; Cordill, M. J.; Dehm, G.: On the limits of the interfacial yield model for fragmentation testing of brittle films on polymer substrates. Philosophical Magazine 92 (25-27), pp. 3363 - 3380 (2012)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…