Jenko, D.; Palm, M.: Transmission electron microscopy of the Fe–Al–Ti–B alloys with additions of Mo. 19th International Microscopy Congress (IMC19), Sidney, Australia (2018)
Prokopčáková, P.; Švec, M.; Lotfian, S.; Palm, M.: Microstructure – property relationships of iron aluminides. 64. Metallkunde-Kolloquium Montanuniversität Leoben, Lech am Arlberg, Austria (2018)
Peng, J.; Moszner, F.; Vogel, D.; Palm, M.: Influence of the Al content on the aqueous corrosion resistance of binary Fe–Al alloys in H2SO4. Intermetallics 2017, Educational Center Kloster Banz, Bad Staffelstein, Germany (2017)
Peng, J.; Vogel, D.; Palm, M.: Influence of the Al content on the corrosion resistance of binary Fe–Al alloys in H2SO4. EUROMAT 2017 – European Congress and Exhibition on Advanced Materials and Processes, Thessaloniki, Greece (2017)
Palm, M.: Development and processing of advanced iron aluminide alloys for application at high temperatures. 62. Metallkunde Kolloquium
, Lech am Arlberg, Austria (2016)
Marx, V. M.; Palm, M.: The wet and hot corrosion behavior of iron aluminides. THERMEC 2016 – Int. Conf. on Processing & Manufacturing of Advanced Materials
, Graz, Austria (2016)
Palm, M.: Iron aluminides: From alloy development to processing. The Materials Chain from Discovery to Production (contributed talk), Bochum, Germany (2016)
Hasemann, G.; Gang, F.; Palm, M.; Bogomol, I.; Krüger , M.: Determining the ternary eutectic alloy composition on the Mo-rich side of the Mo–Si–B system. Advances in Materials & Processing Technologies – AMPT 2015, Madrid, Spain (2015)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
Here the focus lies on investigating the temperature dependent fracture of materials down to the individual microstructural length-scales, such as respective phases, grain/phase boundaries or hetero-interfaces, to understand brittle-ductile transitions in deformation and the role of chemistry or crystallography on it.
In this project we work on correlative atomic structural and compositional investigations on Co and CoNi-based superalloys as a part of SFB/Transregio 103 project “Superalloy Single Crystals”. The task is to image the boron segregation at grain boundaries in the Co-9Al-9W-0.005B alloy.