Wang, Z.; Lu, W.; Min Song, F. A.; Ponge, D.; Raabe, D.; Li, Z.; Li, Z.: High stress twinning in a compositionally complex steel of very high stacking fault energy. Nature Communications 13, 3598 (2022)
Aota, L. S.; Bajaj, P.; Zilnyk, K. D.; Ponge, D.; Zschommler Sandim, H. R.: The origin of abnormal grain growth upon thermomechanical processing of laser powder-bed fusion alloys. Materialia 20, 101243 (2021)
Varanasi, R. S.; Zaefferer, S.; Sun, B.; Ponge, D.: Localized deformation inside the Lüders front of a medium manganese steel. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 824, 141816 (2021)
Benzing, J. T.; Luecke, W. E.; Mates, S. P.; Ponge, D.; Raabe, D.; Wittig, J. E.: Intercritical annealing to achieve a positive strain-rate sensitivity of mechanical properties and suppression of macroscopic plastic instabilities in multi-phase medium-Mn steels. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 803, 140469 (2021)
Wu, X.; Mayweg, D.; Ponge, D.; Li, Z.: Microstructure and deformation behavior of two TWIP/TRIP high entropy alloys upon grain refinement. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 802, 140661 (2021)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.