Dehm, G.: Probing the mechanics of dislocation - grain boundary interactions: Lessons learned from in situ microcompression experiments. 14th International Conference on Local Mechanical Properties 2019 (plenary), Prague, Czech Republic (2019)
Jeong, J.; Dehm, G.; Liebscher, C.: Advances in automatic TEM based orientation mapping with precession electron diffraction. KSM Annual Fall Conference 2019, Gyeongju, South Korea (2019)
Stein, F.; Luo, W.; Kirchlechner, C.; Dehm, G.: Micromechanics of Laves Phases: Strength, Fracture Toughness, and Hardness as Function of Composition and Crystal Structure. Joint EPRI-123 HiMAT Conference on Advances in High Temperature Materials, Nagasaki, Japan (2019)
Dehm, G.: Do we understand the microstructure and properties of materials: New insights by advanced microscopy techniques. Metallurgical Engineering and Materials Science Department, Indian Institute of Technology, Mumbai, India (2019)
Dehm, G.: Resolving grain boundary phase transformations by advanced STEM for fcc metals and multinary alloys. 6th International Symposium on Metastable, Amorphous and Nanostructured Materials (ISMANAM-2019), Chennai, India (2019)
Dehm, G.: Micro- and Nanomechanical Testing of Materials - From Materials Physics to Materials Design. Convegno Nazionale INSTM XII, Ischia Porto, Italy (2019)
Liebscher, C.; Meiners, T.; Peter, N. J.; Frolov, T.; Dehm, G.: Experimental discovery of grain boundary phase transformations unveiled by atomistic simulations. PICS3 2019 Meeting, Centre Interdisciplinaire de Nanoscience de Marseille, Marseille, France (2019)
Dehm, G.: Do we understand the interplay of microstructure and properties of materials: New insights by advanced microscopy techniques. MPI CPFS, Dresden, Germany (2019)
Arigela, V. G.; Oellers, T.; Ludwig, A.; Kirchlechner, C.; Dehm, G.: High temperature mechanical characterization of binary Cu–X alloys produced by Combinatorial Synthesis. International conference on metallurgical coatings and thin films (ICMCTF) 2019, San Diego, CA, USA (2019)
Jeong, J.; Dehm, G.; Liebscher, C.: Advances in automatic TEM based orientation mapping with precession electron diffraction. Joint Max-Planck-Institut für Eisenforschung MPIE) / Ernst Ruska-Centre (ER-C) Workshop, Düsseldorf, Germany (2019)
Kini, M. K.; Kirchlechner, C.; Dehm, G.: Slip transmission across multiple coherent twin boundaries in nanotwinned Ag. Seminar on "Slip Transmission in nanotwinned Ag", Indian Institute of Science, Department of Materials Engineering, Bangalore, India (2019)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project, we study the atomistic structure and phase transformations of tilt grain boundaries in Cu by using aberration-corrected scanning transmission electron microscope to build a relation to the transport properties of the grain boundaries via macroscopic tracer diffusion experiments. In the meantime, we address the impact of the grain…
Because of their excellent corrosion resistance, high wear resistance and comparable low density, Fe–Al-based alloys are an interesting alternative for replacing stainless steels and possibly even Ni-base superalloys. Recent progress in increasing strength at high temperatures has evoked interest by industries to evaluate possibilities to employ…
The goal of this project is to optimize the orientation mapping technique using four-dimensional scanning transmission electron microscopy (4D STEM) in conjunction with precession electron diffraction (PED). The development of complementary metal oxide semiconductor (CMOS)-based cameras has revolutionized the capabilities in data acquisition due to…
The nano-structure of surfaces influences the interactions and reactions occurring on it, which has strong impacts for applications in diverse fields, such as wetting phenomena, electrochemistry or biotechnology. We study these nanoscale structures on functional interfaces by nano-spectroscopy. Furthermore we try to understand their influence on…