Tung, P.-Y.; McEniry, E.; Herbig, M.: The role of electric current in the formation of white-etching-cracks. Philosophical Magazine 101 (1), pp. 59 - 76 (2021)
Morsdorf, L.; Mayweg, D.; Li, Y.; Diederichs, A.; Raabe, D.; Herbig, M.: Moving cracks form white etching areas during rolling contact fatigue in bearings. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 771, 138659 (2020)
Qin, Y.; Li, J.; Herbig, M.: Microstructural origin of the outstanding durability of the high nitrogen bearing steel X30CrMoN15-1. Materials Characterization 159, 110049 (2020)
Kumar, A.; Dutta, A.; Makineni, S. K.; Herbig, M.; Petrov, R.; Sietsma, J.: In-situ observation of strain partitioning and damage development in continuously cooled carbide-free bainitic steels using micro digital image correlation. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 757, pp. 107 - 116 (2019)
Kühbach, M.; Breen, A. J.; Herbig, M.; Gault, B.: Building a Library of Simulated Atom Probe Data for Different Crystal Structures and Tip Orientations Using TAPSim. Microscopy and Microanalysis 25 (2), pp. 320 - 330 (2019)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.