Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Can micro-scale fracture tests provide reliable fracture toughness values? A case study in silicon. Journal of Materials Research 30 (5), pp. 686 - 698 (2015)
Heinz, W.; Robl, W.; Dehm, G.: Influence of initial microstructure on thermomechanical fatigue behavior of Cu films on substrates. Microelectronic Engineering 137, pp. 5 - 10 (2015)
Zhang, Z.; Dehm, G.: Study on the Atomic and Electronic Structure in CrN (VN, TiN) Films using Cs-Corrected TEM. Microscopy and Microanalysis 21 (3), pp. 2079 - 2080 (2015)
Rashkova, B.; Faller, M.; Pippan, R.; Dehm, G.: Growth mechanism of Al2Cu precipitates during in situ TEM heating of a HPT deformed Al–3wt.%Cu alloy. Journal of Alloys and Compounds 600, pp. 43 - 50 (2014)
Imrich, P. J.; Kirchlechner, C.; Motz, C.; Dehm, G.: Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary. Acta Materialia 73, pp. 240 - 250 (2014)
Harzer, T. P.; Daniel, R.; Mitterer, C.; Dehm, G.; Zhang, Z. L.: Transmission electron microscopy characterization of CrN films on MgO(001). Thin Solid Films 545, pp. 154 - 160 (2013)
Daum, B.; Dehm, G.; Clemens, H.; Rester, M.; Fischer, F. D.; Rammerstorfer, F. G.: Elastoplastic buckling as source of misinterpretation of micropillar tests. Acta Materialia 61 (13), pp. 4996 - 5007 (2013)
Taylor, A. A.; Cordill, M. J.; Bowles, L.; Schalko, J.; Dehm, G.: An elevated temperature study of a Ti adhesion layer on polyimide. Thin Solid Films 531, pp. 354 - 361 (2013)
Li, L. L.; An, X. H.; Imrich, P. J.; Zhang, P.; Zhang, Z. J.; Dehm, G.; Zhang, Z. F.: Microcompression and cyclic deformation behaviors of coaxial copper bicrystals with a single twin boundary. Scripta Materialia 69, pp. 199 - 202 (2013)
Zhang, Z.; Li, H.; Daniel, R.; Mitterer, C.; Dehm, G.: Insights into the atomic and electronic structure triggered by ordered nitrogen vacancies in CrN. Physical Review B 87 (1), pp. 014104-1 - 014104-9 (2013)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this ongoing project, we investigate spinodal fluctuations at crystal defects such as grain boundaries and dislocations in Fe-Mn alloys using atom probe tomography, electron microscopy and thermodynamic modeling [1,2].
The aim of the Additive micromanufacturing (AMMicro) project is to fabricate advanced multimaterial/multiphase MEMS devices with superior impact-resistance and self-damage sensing mechanisms.
TiAl-based alloys currently mature into application. Sufficient strength at high temperatures and ductility at ambient temperatures are crucial issues for these novel light-weight materials. By generation of two-phase lamellar TiAl + Ti3Al microstructures, these issues can be successfully solved. Because oxidation resistance at high temperatures is…
We will investigate the electrothermomechanical response of individual metallic nanowires as a function of microstructural interfaces from the growth processes. This will be accomplished using in situ SEM 4-point probe-based electrical resistivity measurements and 2-point probe-based impedance measurements, as a function of mechanical strain and…