Sun, G.; Grundmeier, G.: Surface-enhanced Raman spectroscopy of the growth of ultra-thin organosilicon plasma polymers on nanoporous Ag/SiO2-bilayer films. Thin Solid Films 515 (4), pp. 1266 - 1274 (2006)
Sun, G.: Characterization and Application of New SERS Active Substrates Prepared by Combined Plasma Polymerization and Physical Vapour Deposition. 11th ECASIA, Vienna, Austria (2005)
Sun, G.: Surface-enhanced Raman Spectroscopy Investigation of Surfaces and Interfaces in Thin Films on Metals. Dissertation, Ruhr-Universität, Fakultät für Maschinenbau, Institut für Werkstoffe, Bochum, Germany (2007)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Here the focus lies on investigating the temperature dependent fracture of materials down to the individual microstructural length-scales, such as respective phases, grain/phase boundaries or hetero-interfaces, to understand brittle-ductile transitions in deformation and the role of chemistry or crystallography on it.
This project is part of Correlative atomic structural and compositional investigations on Co and CoNi-based superalloys as a part of SFB/Transregio 103 project “Superalloy Single Crystals”. This project deals with the identifying the local atomic diffusional mechanisms occurring during creep of new Co and Co/Ni based superalloys by correlative…
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.