In situ TEM MEMS based tensile testing of thin films

2D materials including recent TMDCs and metallic thin films are critical for achieving nanoscale miniaturizations in electronic applications. Currently, owing to the difficulty in sample manipulation and lack of appropriate mechanical testing suites, the mechanical properties of 2D materials remain under-explored. In this project, using a combination of a novel plan-view FIB based sample lift out method and a MEMS based tensile testing platform, 2D materials will be in situ tested inside a TEM. Specifically, we plan to investigate the rate-dependent tensile properties of HCP metal thin films and PbMoO₄ (PMO) films.