Electrothermomechanical testing of metallic nanowires
Push towards miniaturization, especially in the electronics sector, has resulted in metallic and semiconductor nanowires being actively incorporated as functional materials. This warrants a critical assessment of the electrical reliability of such nanowires under application relevant combinations of temperature and mechanical loading. In this project, we will investigate the electrothermomechanical response of individual metallic nanowires as a function of microstructural interfaces from the growth processes. This will be conducted using in situ SEM 4-point probe-based electrical resistivity measurements and 2-point probe-based impedance measurements, as a function of mechanical strain and temperature.