Solid state dewetting (SSD), leading to break-up and agglomeration of the thin films, can occur in the films with thicknesses in the order of hundreds of nanometers below the melting temperature of the film. Understanding the underlying processes particularly matters where the stability of the film in applications such as micro-electronics is of concern. On the other hand, we might be able to produce nano/micro particle assemblies with specific size or composition through a well-controlled dewetting procedure and also manipulating the properties of the film such as its thickness and composition. In this project, we investigate the SSD behavior of Co
xCu
100-x alloy thin films. We specifically focus on the effect of the film composition on dewetting behavior.
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