Herbig, M.: Spatially correlated electron microscopy and atom probe tomography: Current possibilities and future perspectives. Scripta Materialia 148, pp. 98 - 105 (2018)
Li, Y.; Herbig, M.; Goto, S.; Raabe, D.: Atomic scale characterization of white etching area and its adjacent matrix in a martensitic 100Cr6 bearing steel. Materials Characterization 123, pp. 349 - 353 (2017)
Li, Y.; Herbig, M.; Goto, S.; Raabe, D.: Formation of nanosized grain structure in martensitic 100Cr6 bearing steels upon rolling contact loading studied by atom probe tomography. Materials Science and Technology 32 (11), pp. 1100 - 1105 (2016)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…