Dehm, G.: Resolving the interplay of structure and energy landscapes of tilt grain boundaries in metals. 3rd ELSICS Conference and Bunsen-Colloquium “Energy Landscapes and Structure in Ion Conducting Solids (ELSICS)”, Ulm, Germany (2023)
Dehm, G.; Liebscher, C.: In situ TEM study of deformation and phase transformation mechanisms in chemically complex alloys. Symposium In-situ & Environmental Microscopy, 20th International Microscopy Congress, Busan, Korea (2023)
Kanjilal, A.; Rehman, U.; Best, J. P.; Dehm, G.: Role of temperature on micromechanical fracture behaviour of Laves phase in Mg–Al–Ca ternary alloy. FEMS EUROMAT 2023, Frankfurt, Germany (2023)
Kanjilal, A.; Rehman, U.; Best, J. P.; Dehm, G.: Role of temperature on micromechanical fracture behavior of Laves phase in Mg–Al–Ca ternary alloy. FEMS Euromat 2023, Frankfurt am Main, Germany (2023)
Brink, T.; Langenohl, L.; Ahmad, S.; Liebscher, C.; Dehm, G.: Atomistic Modeling of the Thermodynamics of Grain Boundaries in fcc Metals. 19th International Conference on Diffusion in Solids and Liquids, Crete, Greece (2023)
Dehm, G.: Grain boundary phases in metallic materials: Structure, stability and properties. MiFuN III - Microstructural Functionality at the Nanoscale, Venice, Italy (2023)
Dehm, G.: On the interplay between grain boundary complexions and chemical composition for fcc metals. Possibilities and Limitations of Quantitative Materials Modeling and Characterization 2023, Bernkastel-Kues, Germany (2023)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
In this project we work on correlative atomic structural and compositional investigations on Co and CoNi-based superalloys as a part of SFB/Transregio 103 project “Superalloy Single Crystals”. The task is to image the boron segregation at grain boundaries in the Co-9Al-9W-0.005B alloy.