Nesselberger, M.; Ashton, S.; Meier, J. C.; Katsounaros, I.; Mayrhofer, K. J. J.; Arenz, M.: The particle size effect on the oxygen reduction reaction activity of Pt catalysts: Influence of electrolyte and relation to single crystal models. Journal of the American Chemical Society 133 (43), pp. 17428 - 17433 (2011)
Meier, J. C.; Galeano, C.; Katsounaros, I.; Topalov, A. A.; Schüth, F.; Mayrhofer, K. J. J.: Electrode Materials for Electrochemical Energy Conversion. Electrochemistry 2012, Fundamental and Engineering Needs for Sustainable Development, München, Germany (2012)
Meier, J. C.; Galeano, C.; Katsounaros, I.; Topalov, A. A.; Schüth, F.; Mayrhofer, K. J. J.: Role of Support Interactions for Activity and Stability of Fuel Cell Catalysts. ACS 15th Annual Green Chemistry & Engineering Conference, Washington, D.C., USA (2011)
Meier, J. C.; Galeano, C.; Katsounaros, I.; Topalov, A. A.; Schüth, F.; Mayrhofer, K. J. J.: IL-TEM and IL-Tomography Stability Investigations of Fuel Cell Catalysts. 63rd Annual Meeting of the International Society of Electrochemistry, Prague, Czech Republic (2012)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…