Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Effect of the atomic structure of complexions on the active disconnection mode during shear-coupled grain boundary motion. Physical Review Materials 8 (6), 063602 (2024)
Chauniyal, A.; Dehm, G.; Janisch, R.: On the role of pre-existing defects in influencing hardness in nanoscale indentations — Insights from atomistic simulations. Journal of the Mechanics and Physics of Solids 154, 104511 (2021)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Deformation mechanism of complexions in a Cu grain boundary under shear. FEMS EUROMAT 2023, Frankfurt am Main, Germany (2023)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Disconnection activation in complexions of a Cu grain boundary under shear. 19th International Conference on Diffusion in Solids and Liquids (DSL-2023), Heraklion, Greece (2023)
Pemma, S.; Brink, T.; Janisch, R.; Dehm, G.: Stress driven grain boundary migration for different complexions of a Cu tilt grain boundary. Materials Science and Engineering Congress 2022, Darmstadt, Germany (2022)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Atomistic simulation study of grain boundary migration for different complexions in copper. DPG-Tagung, Virtual (2021)
Arigela, V. G.; Kirchlechner, C.; Janisch, R.; Hartmaier, A.; Dehm, G.: Setup of a microscale fracture apparatus to study the interface behaviour in materials at high temperatures. Materials Day 2016, Ruhr Universitat Bochum, Bochum, Germany (2016)
Wang, Z.: Investigation of crystallographic character and molten-salt-corrosion properties of grain boundaries in a stainless steel using EBSD and ab-initio calculations. Dissertation, Ruhr-Universität Bochum, Bochum, Germany (2017)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
“Smaller is stronger” is well known in micromechanics, but the properties far from the quasi-static regime and the nominal temperatures remain unexplored. This research will bridge this gap on how materials behave under the extreme conditions of strain rate and temperature, to enhance fundamental understanding of their deformation mechanisms. The…
TiAl-based alloys currently mature into application. Sufficient strength at high temperatures and ductility at ambient temperatures are crucial issues for these novel light-weight materials. By generation of two-phase lamellar TiAl + Ti3Al microstructures, these issues can be successfully solved. Because oxidation resistance at high temperatures is…
We will investigate the electrothermomechanical response of individual metallic nanowires as a function of microstructural interfaces from the growth processes. This will be accomplished using in situ SEM 4-point probe-based electrical resistivity measurements and 2-point probe-based impedance measurements, as a function of mechanical strain and…