Jörg, T.; Cordill, M. J.; Franz, R.; Kirchlechner, C.; Többens, D. M.; Winkler, J.; Mitterer, C.: Thickness dependence of the electro-mechanical response of sputter deposited Mo thin films on polyimide: Insights from in situ synchrotron diffraction tensile tests. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 697, pp. 17 - 23 (2017)
Cordill, M. J.; Marx, V. M.; Kirchlechner, C.: Ductile film delamination from compliant substrates using hard overlayers. Thin Solid Films 571 (P2), pp. 302 - 307 (2014)
Cordill, M. J.; Taylor, A. A.; Berger, J.; Schmidegg, K.; Dehm, G.: Robust mechanical performance of chromium-coated polyethylene terephthalate over a broad range of conditions. Philosophical Magazine 92 (25-27), pp. 3346 - 3362 (2012)
Taylor, A. A.; Cordill, M. J.; Dehm, G.: On the limits of the interfacial yield model for fragmentation testing of brittle films on polymer substrates. Philosophical Magazine 92 (25-27), pp. 3363 - 3380 (2012)
Taylor, A. A.; Edlmayr, V.; Cordill, M. J.; Dehm, G.: The effect of temperature and strain rate on the periodic cracking of amorphous AlxOy films on Cu. Surface and Coatings Technology 206 (7), pp. 1855 - 1859 (2011)
Taylor, A. A.; Edlmayr, V.; Cordill, M. J.; Dehm, G.: The effect of film thickness variations in periodic cracking: Analysis and experiments. Surface and Coatings Technology 206 (7), pp. 1830 - 1836 (2011)
Cordill, M. J.; Schmidegg, K.; Dehm, G.: Interface failure and adhesion measured by focused ion beam cutting of metal-polymer interfaces. Philosophical Magazine Letters 91 (8), pp. 530 - 536 (2011)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project we developed a phase-field model capable of describing multi-component and multi-sublattice ordered phases, by directly incorporating the compound energy CALPHAD formalism based on chemical potentials. We investigated the complex compositional pathway for the formation of the η-phase in Al-Zn-Mg-Cu alloys during commercial…
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.