Schmitt, M.; Spiegel, M.: High Temperature Corrosion: Corrosion process of stainless steels and nickel base alloys under BtE and WtE conditions. International Conference on Waste and Biomass Combustion, Michelangelo Hotel Milano, Italy (2008)
Schmitt, M.; Spiegel, M.: Interim report on corrosion data: Dependence on variation of chemical environment. NextGenBioWaste, 2nd Progress Meeting 2008, Schiphol Airport Amsterdam, The Netherlands (2008)
Schmitt, M.; Spiegel, M.: Contribution to the analysis of the corrosion process of metallic materials in incineration plants. EUROCORR 2008, EICC Edinburgh, UK (2008)
Schmitt, M.; Spiegel, M.: High Temperature Corrosion: Corrosion mechanism of candidate materials in lab-scale incineration environments. General Assembly NextGenBioWaste 2008, De Zwijger Amsterdam, The Netherlands (2008)
Schmitt, M.; Spiegel, M.: Corrosion and fouling data of candidate materials for WtE components: Part II. NextGenBioWaste, 1st Progress Meeting 2008, Schiphol Airport Amsterdam, The Netherlands (2008)
Schmitt, M.; Spiegel, M.: Corrosion and fouling data of candidate materials for WtE components: Part I. NextGenBioWaste, 2nd Progress Meeting 2007, Schiphol Airport Amsterdam, The Netherlands (2007)
Schmitt, M.; Spiegel, M.: Introduction to the Working Group NGBW. NextGenBioWaste, 1st Progress Meeting 2007, Schiphol Airport Amsterdam, The Netherlands (2007)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…