Brink, T.; Langenohl, L.; Ahmad, S.; Liebscher, C.; Dehm, G.: Atomistic Modeling of the Thermodynamics of Grain Boundaries in fcc Metals. 19th International Conference on Diffusion in Solids and Liquids, Crete, Greece (2023)
Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Pemma, S.; Liebscher, C.; Dehm, G.: Diffusionless congruent grain boundary phase transitions in metals: Simulation and experimental imaging. 2021 Fall Meeting of the European Materials Research
Society
, Virtual (2021)
Frommeyer, L.; Brink, T.; Freitas, R.; Frolov, T.; Dehm, G.; Liebscher, C.: Congruent grain boundary phase transformations revealed by STEM in pure copper. Microscopy conference Joint Meeting of Dreiländertagungn & Multinational Congress on Microscopy MC 2021, virtual, Vienna, Austria (2021)
Liebscher, C.: How do grain boundaries transform in metallic alloys? Institute of Material Physics, Westfälische Wilhelms-Universität Münster, Online Colloqium, Münster, Germany (2021)
Liebscher, C.; Lu, W.; Dehm, G.; Raabe, D.; Li, Z.: Complex phase transformation pathways in high entropy alloys explored by in situ S/TEM. Third International Conference on High Entropy Materials, Berlin, Germany (2020)
Ahmad, S.; Liebscher, C.; Dehm, G.: To decipher the novel atomic structure of [111] tilt grain boundaries in Al. Material Science and Engineering Congress - MSE 2020, virtual, Darmstadt, Germany (2020)
Devulapalli, V.; Dehm, G.; Liebscher, C.: Unravelling grain boundary structures in Ti thin films using aberration-corrected transmission electron microscopy. MSE Darmdtadt (Virtual), Darmstadt, Germany (2020)
Saood, S.; Liebscher, C.; Dehm, G.: Observing the atomic structure of high angle [111] tilt grain boundaries in Al. Materials Science and Engineering Congress MSE 2020, virtual (2020)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.
This project aims to develop a micromechanical metrology technique based on thin film deposition and dewetting to rapidly assess the dynamic thermomechanical behavior of multicomponent alloys. This technique can guide the alloy design process faster than the traditional approach of fabrication of small-scale test samples using FIB milling and…
The thorough, mechanism-based, quantitative understanding of dislocation-grain boundary interactions is a central aim of the Nano- and Micromechanics group of the MPIE [1-8]. For this purpose, we isolate a single defined grain boundary in micron-sized sample. Subsequently, we measure and compare the uniaxial compression properties with respect to…