Freysoldt, C.; Hickel, T.; Janßen, J.; Wang, N.; Zendegani, A.: High-throughput optimization of finite temperature phase stabilities: Concepts and application. Coffee with Max Planck, virtual seminar organized by the MPIE, Düsseldorf, Germany (2021)
Hickel, T.; Freysoldt, C.; Janßen, J.; Wang, N.; Zendegani, A.: High-throughput optimization of finite temperature phase stabilities: Concepts and application. Coffee with Max Planck, virtual seminar organized by the MPIE, Düsseldorf, Germany (2021)
Freysoldt, C.: Modelling of charged point defects with density-functional theory. 4th International Workshop on Models and Data for Plasma-Material Interaction in Fusion Devices, National Institute for Fusion Science (NIFS), Toki, Japan (2019)
Freysoldt, C.: Ab initio simulations of charged surfaces. Workshop “High electric fields in electrochemistry and atom probe tomography", Ringberg Castle, Germany (2017)
Dehm, G.; Harzer, T. P.; Dennenwaldt, T.; Freysoldt, C.; Liebscher, C.: Chemical demixing and thermal stability of supersaturated nanocrystalline CuCr alloys: Insights from advanced TEM. MS&T '16, Materials Science & Technology 2016 Conference & Exhibition, Salt Lake City, UT, USA (2016)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
This project aims to investigate the influence of grain boundaries on mechanical behavior at ultra-high strain rates and low temperatures. For this micropillar compressions on copper bi-crystals containing different grain boundaries will be performed.