Tsybenko, H.; Xia, W.; Dehm, G.; Brinckmann, S.: On the commensuration of plastic plowing at the microscale. Nanobrücken 2020: Nanomechanical Testing Conference & Bruker User Meeting, Düsseldorf, Germany (2020)
Duarte, M. J.; Fang, X.; Brinckmann, S.; Dehm, G.: Hydrogen-microstructure interactions in bcc FeCr alloys by in-situ nanoindentation. ECI, Nanomechanical Testing in Materials Research and Development VI, Dubrovnik, Croatia (2017)
Fink, C.; Brinckmann, S.; Dehm, G.: Nanotribology and Microstructure Evolution in Pearlite. 3rd European Symposium on Friction, Wear and Wear Protection, Karlsruhe, Germany (2014)
Brinckmann, S.: Dislocation emission from short penny-shaped cracks: A multiscale model of atomistic & dislocation dynamics. Nanomechanical Testing in Materials Research and Development IV, Olhão (Algarve), Portugal (2013)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…