Harzer, T. P.; Duarte, M. J.; Dehm, G.: In-situ TEM isothermal annealing of nanocrystalline supersaturated Cu–Cr thin film alloys. 80th Annual Conference of the DPG and DPG Spring Meeting, Regensburg, Germany (2016)
Jaya, B. N.; Köhler, M.; Schnabel, V.; Raabe, D.; Schneider, J. M.; Kirchlechner, C.; Dehm, G.: Micro-scale fracture behavior of Co based metallic glass thin films. 2016 TMS Annual Meeting and Exhibition Symposium: In Operando Nano- and Micro-mechanical Characterization of Materials with Special Emphasis on In Situ Techniques, Nashville, TN, USA (2016)
Hieke, S. W.; Dehm, G.; Scheu, C.: Investigation of solid state dewetting phenomena of epitaxial Al thin films on sapphire using electron microscopy. The 16th European Microscopy Congress (EMC 2016), Lyon, France (2016)
Hieke, S. W.; Dehm, G.; Scheu, C.: Solid state dewetting of epitaxial Al thin films on sapphire studied by electron microscopy. Materials Research Society Fall Meeting & Exhibition 2016 (MRS Fall 2016), Boston, MA, USA (2016)
Luo, W.; Kirchlechner, C.; Dehm, G.; Stein, F.: A New Method to Study the Composition Dependence of Mechanical Properties of Laves. MRS Fall Meeting 2016, Boston, MA, USA (2016)
Dehm, G.: Mikromechanik: lokale Einblicke in die mechanischen Eigenschaften von Materialien. Eröffnung des Christian Doppler Labors für
Lebensdauer und Zuverlässigkeit von Grenzflächen in komplexen Mehrlagenstrukturen der Elektronik „RELAB“, Vienna, Austria (2015)
Dehm, G.: New insights into the mechanical behavior of interface controlled metals. Colloquium Materials Modelling, Institut für Materialprüfung, Werkstoffkunde und Festigkeitslehre (IMWF), Universität Stuttgart , Stuttgart, Germany (2015)
Dehm, G.; Imrich, P. J.; Malyar, N.; Kirchlechner, C.: Differences in deformation behavior of bicrystalline Cu micropillars containing different grain boundaries. MS&T 2015 (Materials Science and Technology) meeting, symposium entitled "Deformation and Transitions at Grain Boundaries", Columbus, OH, USA (2015)
Dehm, G.; Zhang, Z.; Völker, B.: Structure and strength of metal-ceramic interfaces: New insights by Cs corrected TEM and advances in miniaturized mechanical testing. MS&T 2015 (Materials Science and Technology) meeting, Symposium entitled "Structures and Properties of Grain Boundaries: Towards an atomic-scale understanding of ceramics", Columbus, OH, USA (2015)
Dehm, G.; Harzer, T. P.; Völker, B.; Imrich, P. J.; Zhang, Z.: Towards New Insights on Interface Controlled Materials by Advanced Electron Microscopy. Frontiers of Electron Microscopy in Materials Science Meeting (FEMMS 2015), Lake Tahoe, CA, USA (2015)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.
This project aims to investigate the dynamic hardness of B2-iron aluminides at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1 and study the microstructure evolution across strain rate range.