He, J.; Scholz, F.; Horst, O. M.; Thome, P.; Frenzel, J.; Eggeler, G. F.; Gault, B.: Corrigendum to ‘On the Re segregation at the low angle grain boundary in a single crystal Ni-base superalloy’ Scripta Materialia Volume 185, August 2020, Pages 88-93 (Scripta Materialia (2020) 185 (88–93), (S1359646220302475), (10.1016/j.scriptamat.2020.03.063)). Scripta Materialia 187, p. 309 (2020)
Edmondson, P. D.; Gault, B.; Gilbert, M. R.: An atom probe tomography and inventory calculation examination of second phase precipitates in neutron irradiated single crystal tungsten. Nuclear Fusion 60 (12), 126013 (2020)
Antonov, S.; Li, B.; Gault, B.; Tan, Q.: The effect of solute segregation to deformation twin boundaries on the electrical resistivity of a single-phase superalloy. Scripta Materialia 186, pp. 208 - 212 (2020)
Blum, T.; Valley, J.; Gault, B.; Stephenson, L.: Application of SIMS and APT to Understand Scale Dependent U-Pb Isotope Behavior in Zircon. Microscopy and Microanalysis 26 (S2), pp. 2994 - 2995 (2020)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…