Biedermann, P. U.: Intermediates of the Electrochemical Oxygen Reduction in Aqueous Media. ICAMS-Seminar, Interdisciplnary Centre for Advanced Materials Simulation, Ruhr-Universität Bochum, Germany (2010)
Hamou, R. F.; Biedermann, P. U.; Erbe, A.; Rohwerder, M.: Numerical Investigation of Electrode Surface Potential Mapping with Scanning Electrochemical Potential Microscopy. The 12th International Scanning Probe Microscopy Conference, Sapporo, Japan (2010)
Hamou, R. F.; Biedermann, P. U.; Erbe, A.; Rohwerder, M.: Numerical simulation of probing the electric double layer by scanning electrochemical Potential microscopy. 217th ECS Meeting, Vancouver, Canada (2010)
Biedermann, P. U.: Electrochemical Oxygen Reduction in Aqueous Solution, A DFT Study of the Intermediates. NACE Corrosion 2010, San Antonio, TX, USA (2010)
Biedermann, P. U.: Theoretical Investigation of the Electrochemical Oxygen Reduction Mechanism. Minisymposium "Perspectives in Quantum chemistry for Electrochemistry", Ruhr-Universität Bochum, Germany (2010)
Hamou, R. F.; Biedermann, P. U.; Erbe, A.; Rohwerder, M.: Numerical simulation of probing the electric double layer by scanning electrochemical potential microscopy. International Workshops on Surface Modification for Chemical and Biochemical Sensing, Przegorzaly, Poland (2009)
Hamou, R. F.; Biedermann, P. U.; Erbe, A.; Rohwerder, M.: Screening effects in probing the double layer by scanning electrochemical potential microscopy. Comsol European Conference October 2009, Milan, Italy (2009)
Hamou, R. F.; Biedermann, P. U.; Erbe, A.; Rohwerder, M.: Simulation of probing the electric double layer by scanning electrochemical potential microscopy (SECPM). 11th International Fischer Symposium on Microscopy in Electrochemistry, Benediktbeuern, Germany (2009)
Hamou, R. F.; Biedermann, P. U.; Blumenau, A. T.: FEM Simulation of the Scanning Electrochemical Potential Microscopy (SECPM). SurMat Seminar, Schloß Gnadenthal, Kleve, Germany (2008)
Torres, E.; Biedermann, P. U.; Blumenau, A. T.: High density structures of ethyl-thiol SAM´s on Au(111): A DFT study. SurMat Seminar, Schloß Gnadenthal, Kleve, Germany (2008)
Torres, E.; Biedermann, P. U.; Blumenau, A. T.: The Role of Gold Adatoms in Self-Assembled Monolayers of Thiol on Au(111). 6th Congress of the International Society for Theoretical Chemical Physics, ISTCP-VI, University of British Columbia, Vancouver, Canada (2008)
Biedermann, P. U.; Blumenau, A. T.: Ab-Initio Calculation of the Standard Hydrogen Electrode Potential and Application to the Mechanism of the Oxygen Reduction. Workshop on Converging Theoretical and Experimental Approaches to Corrosion, MPIE, Düsseldorf, Germany (2007)
Blumenau, A. T.; Biedermann, P. U.; Torres, E.: Modelling adhesion and delamination at oxide/polymer interfaces. Multiscale Material Modeling of Condensed Matter, MMM2007, St. Feliu de Guixols, Spain (2007)
Biedermann, P. U.; Torres, E.; Blumenau, A. T.: Oxygen Reduction at Thiol/Au(111)SAMs, Atomistic Modelling and Experiment. 212th ECS Meeting, Washington, D.C., USA (2007)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…