Grundmeier, G.; Fink, N.; Giza, M.; Popova, V.; Vlasak, R.; Wapner, K.: Application of combined spectroscopic, electrochemical and microscopic techniques for the understanding of adhesion and de-adhesion at polymer/metal interfaces. 24. Spektrometertagung, Dortmund, Germany (2005)
Grundmeier, G.; Wapner, K.: Anwendung einer neuen höhenregulierbaren Rasterkelvinsonde zur Untersuchung der Stabilität von Klebstoff-Metall-Grenzflächen in feuchten und korrosiven Atmosphären. Swissbonding, Rapperswil am Zürichsee, Switzerland (2005)
Grundmeier, G.; Wapner, K.; Schönberger, B.; Stratmann, M.: Fundamentals and Applications of a new height regulated Scanning Kelvin Probe in Corrosion and Adhesion Science. ISE 2004, Thessaloniki, Greece (2004)
Grundmeier, G.; Wapner, K.; Schönberger, B.; Stratmann, M.: Introduction of a height regulated Scanning Kelvin Probe for the simultaneous measurement of surface topography and interfacial electrode potentials in corrosive environments. ISE Conference, 55th Annual Meeting, Thessaloniki, Greece (2004)
Grundmeier, G.; Wapner, K.: Water diffusion measurements in a model adhesive/silicon lap joint using FTIR-spectroscopy: Differentiation between bulk and interfacial diffusion. Euradh 2004, Freiburg, Germany (2004)
Wapner, K.; Grundmeier, G.: Extended Abstract: Water diffusion measurements in a model adhesive/silicon lap joint using FTIR-spectroscopy: differentiation between bulk and interfacial diffusion. Euradh2004/Adhesion2004, Freiburg, Germany (2004)
Wapner, K.; Stratmann, M.; Grundmeier, G.: Extended Abstract: Non-destructive, in-situ measurement of de-adhesion processes at buried adhesive/metal interfaces by means of a new scanning Kelvin probe blister Test. Euradh2004/Adhesion2004, Freiburg, Germany (2004)
Grundmeier, G.; Wapner, K.; Stratmann, M.: Applications of a new height regulated Scanning Kelvin Probe for the study of polymer/metal interfaces in corrosive environments. ICEPAM 2004, Helsinki, Finnland (2004)
Grundmeier, G.; Wapner, K.; Schönberger, B.; Stratmann, M.: Non-destructive, real time in-situ measurement of de-adhesion processes at buried adhesive/metal interfaces by means of a new Scanning Kelvin Probe Blister Test. Annual Meeting of the American Adhesion Society, Wilmington, UK (2004)
Wapner, K.; Grundmeier, G.: Application of the Scanning Kelvin Probe for the study of de-adhesion processes at thin film engineered adhesive/metal interfaces. Annual Meeting of the American Adhesion Society, Wilmington, UK (2004)
Posner, R.; Wapner, K.; Stratmann, M.; Grundmeier, G.: Hydrated Ion Transport at Polymer/Oxide/Metal-Interfaces in Non-Corrosive Atmosphere: Influence of Electric Field Gradients. Gordon Conference Graduate Research Seminar on Aqueous Corrosion, Colby Sawyer College, New London, NH, USA (2008)
Klimow, G.; Wapner, K.; Grundmeier, G.: Applications of a Scanning Kelvin Probe for Studying Modified Adhesive/Metal Interfaces under Corrosive and Mechanical Load. 3rd World Congress on Adhesion and Related Phenomena, WCARP-III, Beijing, China (2006)
Wapner, K.; Stratmann, M.; Grundmeier, G.: Non-destructive, In-Situ Measurement of De-Adhesion Processes at Buried Adhesive/Metal Interfaces by Means of a New Scanning Kelvin Probe Blister Test. EUROMAT 2005, Prague, Czech Republic (2005)
Wapner, K.; Stratmann, M.; Grundmeier, G.: The application of the scanning Kelvin probe for investigating the deadhesion of adhesives on iron and zinc. EURADH 2002, Glasgow, UK (2002)
Wapner, K.: Grenzflächenchemische und elektrochemische Untersuchungen zur Haftung und Enthaftung an modifizierten Klebstoff/Metall-Grenzflächen. Dissertation, Ruhr-Universität Bochum, Fakultät für Chemie, Bochum, Germany (2006)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…