Khan, T. R.; Vimalanandan, A.; Marlow, F.; Erbe, A.; Rohwerder, M.: Existence of a lower critical radius for incorporation of silica particles into zinc during electro-codeposition. ACS Applied Materials and Interfaces 4 (11), pp. 6221 - 6227 (2012)
Khan, T. R.; Erbe, A.; Auinger, M.; Marlow, F.; Rohwerder, M.: Electrodeposition of zinc-silica composite coatings: Challenges in incorporating functionalized silica particles into a zinc matrix. Science and Technology of Advanced Materials 12 (5), 055005 (2011)
Khan, T. R.; de la Fuenta, D.; Rohwerder, M.: Electrolytic co-deposition of SiO2 nanoparticles with zinc for improvement of corrosion protection. 59th Annual Meeting of the International Society of Electrochemistry, Seville, Spain (2008)
Khan, T. R.; Vimalanandan, A.; Rohwerder, M.; Marlow, F.: Electrodeposition of Zinc-Silica Coatings for Smart Corrosion Protection. EUROCORR 2011, the European Corrosion Congress “Developing Solutions For The Global Challenge”, Stockholm, Sweden (2011)
Khan, T. R.: Nanocomposite coating: Codeposition of SiO2 particles during electrogalvanizing. Dissertation, Fakultät für Maschinenbau der Ruhr-Universität Bochum, Bochum, Germany (2011)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…