Grote, J.-P.; Žeradjanin, A. R.; Cherevko, S.; Mayrhofer, K. J. J.: Electrochemical CO2 reduction: A Combinatorial High-Throughput Approach for Catalytic Activity, Stability, and Selectivity Investigations. Electrochemistry 2014, Mainz, Germany (2014)
Grote, J.-P.; Žeradjanin, A. R.; Cherevko, S.; Mayrhofer, K. J. J.: Electrochemical CO2 reduction: A Combinatorial High-Throughput Approach for Catalytic Activity, Stability, and Selectivity Investigations. 247th ACS National Meeting, Dallas, TX, USA (2014)
Cherevko, S.; Topalov, A. A.; Žeradjanin, A. R.; Mayrhofer, K. J. J.: Coupling of electrochemistry and inductively plasma - Mass spectroscopy: Investigation of the noble metals corrosion. 59th International Conference on Analytical Sciences and Spectroscopy(ICASS)
, Mont-Tremblant, Canada (2013)
Žeradjanin, A. R.: Impact of the spatial distribution of morphological patterns on the efficiency of electrocatalytic gas evolving reactions. Seminar at Serbian Chemical Society, Belgrade, Serbia (2013)
Topalov, A. A.; Cherevko, S.; Žeradjanin, A. R.; Mayrhofer, K. J. J.: Stability of Electrocatalyst Materials – A Limiting Factor for the Deployment of Electrochemical Energy Conversion? Third Russian-German Seminar on Catalysis “Bridging the Gap between Model and Real Catalysis. Energy-Related Catalysis”, Burduguz, Lake Baikal, Russia (2013)
Grote, J.-P.; Žeradjanin, A. R.; Cherevko, S.; Mayrhofer, K. J. J.: Electrochemical CO2 Reduction A Combinatorial High-Throughput Approach for Catalytic Activity, Stability and Selectivity Investigations. International Symposium on Electrocatalysis: Explorations of the Volcano Landscape, Whistler, BC, Canada (2014)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…